A high fill-factor infrared bolometer using micromachined multilevel electrothermal structures

Hyung Kew Lee, Jun Bo Yoon, Euisik Yoon, Sang Baek Ju, Yoon Joong Yong, Wook Lee, Sang Gook Kim

Research output: Contribution to journalArticle

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Abstract

A high fill-factor uncooled infrared (IR) bolometer has been fabricated by using thin-film titanium resistors sandwiched in a surface-micromachined silicon oxinitride membrane (50 μm × 50 μm). This bolometer is realized in multilevel electrothermal structures with a fill-factor over 92%. From the multilevel structure, thermal isolation can be independently optimized without sacrificing IR absorbing area. Initial measurements show a thermal time constant of 12 ms, a responsivity of 1600 V/W, and a detectivity (D*) of 5 × 108 cm√Hz/W.

Original languageEnglish
Pages (from-to)1489-1491
Number of pages3
JournalIEEE Transactions on Electron Devices
Volume46
Issue number7
Publication statusPublished - 1999 Jul 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Lee, H. K., Yoon, J. B., Yoon, E., Ju, S. B., Yong, Y. J., Lee, W., & Kim, S. G. (1999). A high fill-factor infrared bolometer using micromachined multilevel electrothermal structures. IEEE Transactions on Electron Devices, 46(7), 1489-1491.