Abstract
Microprocessors and SoCs employ multiple temperature sensors to prevent overheating and ensure reliable operation. Such sensors should be small (<10,000μm2) to monitor local hot-spots in dense layouts. They should also be moderately accurate (1°C) up to high temperatures (≥125°C), so that the system throttling temperature can be set as close as possible to the maximum allowable die temperature. Furthermore, they should be fast (1kS/s) and consume low power (tens of μW).
Original language | English |
---|---|
Title of host publication | 2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 - Digest of Technical Papers |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 76-78 |
Number of pages | 3 |
ISBN (Electronic) | 9781728195490 |
DOIs | |
Publication status | Published - 2021 Feb 13 |
Event | 2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 - San Francisco, United States Duration: 2021 Feb 13 → 2021 Feb 22 |
Publication series
Name | Digest of Technical Papers - IEEE International Solid-State Circuits Conference |
---|---|
Volume | 64 |
ISSN (Print) | 0193-6530 |
Conference
Conference | 2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 |
---|---|
Country/Territory | United States |
City | San Francisco |
Period | 21/2/13 → 21/2/22 |
Bibliographical note
Publisher Copyright:© 2021 IEEE.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering