Microprocessors and SoCs employ multiple temperature sensors to prevent overheating and ensure reliable operation. Such sensors should be small (<10,000μm2) to monitor local hot-spots in dense layouts. They should also be moderately accurate (1°C) up to high temperatures (≥125°C), so that the system throttling temperature can be set as close as possible to the maximum allowable die temperature. Furthermore, they should be fast (1kS/s) and consume low power (tens of μW).
|Title of host publication||2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 - Digest of Technical Papers|
|Publisher||Institute of Electrical and Electronics Engineers Inc.|
|Number of pages||3|
|Publication status||Published - 2021 Feb 13|
|Event||2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 - San Francisco, United States|
Duration: 2021 Feb 13 → 2021 Feb 22
|Name||Digest of Technical Papers - IEEE International Solid-State Circuits Conference|
|Conference||2021 IEEE International Solid-State Circuits Conference, ISSCC 2021|
|Period||21/2/13 → 21/2/22|
Bibliographical notePublisher Copyright:
© 2021 IEEE.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering