A highly sensitive capacitive-type humidity sensor using customized polyimide film without hydrophobic elements

Yong Ho Kim, Yong Jun Kim, Jun Young Lee, Jung Hyun Kim, Kyu Ho Shin

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

In this paper, we report the design, fabrication and measurement results of a highly sensitive capacitive-type humidity sensor using a customized polyimide film without hydrophobic elements for evaluating the hermeticity of micropackages. For higher sensitivity, a customized polyimide film as a moisture-absorbing layer is applied instead of using general polyimide films for microelectronic applications. The polyimide film is obtained by synthesizing polyamic acid composed of m-pyromellitic dianhydride, phe-nylenediamine and dimethylacetamide followed by thermal polymerization. An assembly of the humidity sensor and a micropackage which is realized with localized heating and bonding with a polysilicon heater is also fabricated to verify packaging compatibility. Characteristics of the sensor which include sensitivity, hysteresis and stability are measured. The measurement results show a percent normalized capacitance change of 37.45/ %RH, hysteresis of 0.77% over a range from 10 to 90%RH and stability of 0.25% maximum drift from the average value at 50%RH for 120 min. According to these results, it is expected that the proposed humidity sensor can be applied to evaluate the hermeticity of micropackages.

Original languageEnglish
Pages (from-to)109-117
Number of pages9
JournalSensors and Materials
Volume16
Issue number3
Publication statusPublished - 2004 Jan 1

Fingerprint

Humidity sensors
polyimides
Polyimides
humidity
sensors
Hysteresis
hysteresis
sensitivity
heaters
Polysilicon
packaging
microelectronics
Microelectronics
moisture
compatibility
Packaging
Capacitance
Moisture
polymerization
assembly

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Materials Science(all)

Cite this

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abstract = "In this paper, we report the design, fabrication and measurement results of a highly sensitive capacitive-type humidity sensor using a customized polyimide film without hydrophobic elements for evaluating the hermeticity of micropackages. For higher sensitivity, a customized polyimide film as a moisture-absorbing layer is applied instead of using general polyimide films for microelectronic applications. The polyimide film is obtained by synthesizing polyamic acid composed of m-pyromellitic dianhydride, phe-nylenediamine and dimethylacetamide followed by thermal polymerization. An assembly of the humidity sensor and a micropackage which is realized with localized heating and bonding with a polysilicon heater is also fabricated to verify packaging compatibility. Characteristics of the sensor which include sensitivity, hysteresis and stability are measured. The measurement results show a percent normalized capacitance change of 37.45/ {\%}RH, hysteresis of 0.77{\%} over a range from 10 to 90{\%}RH and stability of 0.25{\%} maximum drift from the average value at 50{\%}RH for 120 min. According to these results, it is expected that the proposed humidity sensor can be applied to evaluate the hermeticity of micropackages.",
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A highly sensitive capacitive-type humidity sensor using customized polyimide film without hydrophobic elements. / Kim, Yong Ho; Kim, Yong Jun; Lee, Jun Young; Kim, Jung Hyun; Shin, Kyu Ho.

In: Sensors and Materials, Vol. 16, No. 3, 01.01.2004, p. 109-117.

Research output: Contribution to journalArticle

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