A low-cure-temperature copper nano ink for highly conductive printed electrodes

Byoungyoon Lee, Yoonhyun Kim, Seungnam Yang, Inbum Jeong, Jooho Moon

Research output: Contribution to journalArticlepeer-review

113 Citations (Scopus)


We have developed a copper metal-organic-based conductive ink which can be applied to printing and roll-to-roll processes. Metal-organics printed on flexible substrates decompose into highly conductive copper metal when annealed at above 250 °C. The new nano ink was prepared by mixing copper carboxylate with copper complex nano particles of a mean size below 100 nm. The viscosity of the copper ink was in the range of 104-105 mPa s (at 50 rpm). The resistivity of the conductive film, after annealing under the condition of 3% H2 above 250 °C for 20 min, was below 10 μΩ cm and it could be further reduced to 4.4 μΩ cm when annealed at 320 °C for 20 min. We successfully demonstrated a printable copper nano ink that proceeds to form highly conductive metal film when annealed at low temperature on flexible substrates.

Original languageEnglish
Pages (from-to)e157-e160
JournalCurrent Applied Physics
Issue number2 SUPPL.
Publication statusPublished - 2009 Mar

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Physics and Astronomy(all)


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