Abstract
We have developed a copper metal-organic-based conductive ink which can be applied to printing and roll-to-roll processes. Metal-organics printed on flexible substrates decompose into highly conductive copper metal when annealed at above 250 °C. The new nano ink was prepared by mixing copper carboxylate with copper complex nano particles of a mean size below 100 nm. The viscosity of the copper ink was in the range of 104-105 mPa s (at 50 rpm). The resistivity of the conductive film, after annealing under the condition of 3% H2 above 250 °C for 20 min, was below 10 μΩ cm and it could be further reduced to 4.4 μΩ cm when annealed at 320 °C for 20 min. We successfully demonstrated a printable copper nano ink that proceeds to form highly conductive metal film when annealed at low temperature on flexible substrates.
Original language | English |
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Pages (from-to) | e157-e160 |
Journal | Current Applied Physics |
Volume | 9 |
Issue number | 2 SUPPL. |
DOIs | |
Publication status | Published - 2009 Mar |
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Physics and Astronomy(all)