TY - JOUR
T1 - A low-cure-temperature copper nano ink for highly conductive printed electrodes
AU - Lee, Byoungyoon
AU - Kim, Yoonhyun
AU - Yang, Seungnam
AU - Jeong, Inbum
AU - Moon, Jooho
N1 - Copyright:
Copyright 2009 Elsevier B.V., All rights reserved.
PY - 2009/3
Y1 - 2009/3
N2 - We have developed a copper metal-organic-based conductive ink which can be applied to printing and roll-to-roll processes. Metal-organics printed on flexible substrates decompose into highly conductive copper metal when annealed at above 250 °C. The new nano ink was prepared by mixing copper carboxylate with copper complex nano particles of a mean size below 100 nm. The viscosity of the copper ink was in the range of 104-105 mPa s (at 50 rpm). The resistivity of the conductive film, after annealing under the condition of 3% H2 above 250 °C for 20 min, was below 10 μΩ cm and it could be further reduced to 4.4 μΩ cm when annealed at 320 °C for 20 min. We successfully demonstrated a printable copper nano ink that proceeds to form highly conductive metal film when annealed at low temperature on flexible substrates.
AB - We have developed a copper metal-organic-based conductive ink which can be applied to printing and roll-to-roll processes. Metal-organics printed on flexible substrates decompose into highly conductive copper metal when annealed at above 250 °C. The new nano ink was prepared by mixing copper carboxylate with copper complex nano particles of a mean size below 100 nm. The viscosity of the copper ink was in the range of 104-105 mPa s (at 50 rpm). The resistivity of the conductive film, after annealing under the condition of 3% H2 above 250 °C for 20 min, was below 10 μΩ cm and it could be further reduced to 4.4 μΩ cm when annealed at 320 °C for 20 min. We successfully demonstrated a printable copper nano ink that proceeds to form highly conductive metal film when annealed at low temperature on flexible substrates.
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U2 - 10.1016/j.cap.2009.03.008
DO - 10.1016/j.cap.2009.03.008
M3 - Article
AN - SCOPUS:67349089046
VL - 9
SP - e157-e160
JO - Current Applied Physics
JF - Current Applied Physics
SN - 1567-1739
IS - 2 SUPPL.
ER -