Abstract
A finite ground coplanar (FGC) line-to-waveguide transition utilizing a novel, free-standing printed E-plane probe has been demonstrated in W-band (75-110GHz). One way to improve the performance of such a transition and to extend its utility well into the submillimeter range is to thin the supporting substrate beneath the probe. This paper presents the W-band performance of a fully micromachined finite ground coplanar line-to-silicon diamond waveguide transition with the substrate beneath the probe entirely removed, thus forming a free-stranding metal structure.
| Original language | English |
|---|---|
| Pages (from-to) | 1871-1874 |
| Number of pages | 4 |
| Journal | IEEE MTT-S International Microwave Symposium Digest |
| Volume | 3 |
| DOIs | |
| Publication status | Published - 2002 Jan 1 |
All Science Journal Classification (ASJC) codes
- Radiation
- Condensed Matter Physics
- Electrical and Electronic Engineering
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Cite this
Lee, Y., Becker, J. P., East, J. R., & Katehi, L. P. B. (2002). A micromachined finite coplanar line-to-silicon micromachined waveguide transition for millimeter and submillimeter wave applications. IEEE MTT-S International Microwave Symposium Digest, 3, 1871-1874. https://doi.org/10.1109/MWSYM.2002.1012228