A New 3-D Fuse Architecture to Improve Yield of 3-D Memories

Wooheon Kang, Changwook Lee, Hyunyul Lim, Sungho Kang

Research output: Contribution to journalArticle

Abstract

A new 3-D fuse architecture is proposed to improve the yield of 3-D memories. Because the 2-D memories are stacked to form a 3-D memory, the repair status of the prebond is kept as the good status. However, if faults occur in the postbond on the same cells which were repaired in the prebond, they must be identified and repaired because they cannot be repaired by the previous methods. There is no research on the repair the same faulty cells which occur in the prebond and postbond yet. Therefore, the new 3-D fuse architecture is proposed to repair the faulty cells which occur in the prebond and postbond. The redundancies which repair the faulty cells in the prebond are invalidated. The faulty cells are repaired by other redundancies in the postbond by the proposed 3-D fuse architecture. Thus, the proposed technique can improve the yield of 3-D memories. The experimental results show that the proposed technique can achieve higher yields of 3-D memories because only the proposed technique can repair the same faulty cells occurring in the prebond and postbond, and verify the good repair status of the 3-D memories.

Original languageEnglish
Article number7395326
Pages (from-to)1763-1767
Number of pages5
JournalIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Volume35
Issue number10
DOIs
Publication statusPublished - 2016 Oct 1

Fingerprint

Electric fuses
Repair
Data storage equipment
Redundancy

All Science Journal Classification (ASJC) codes

  • Software
  • Computer Graphics and Computer-Aided Design
  • Electrical and Electronic Engineering

Cite this

@article{867e141d69cb4a8c8f0cc38154c147bd,
title = "A New 3-D Fuse Architecture to Improve Yield of 3-D Memories",
abstract = "A new 3-D fuse architecture is proposed to improve the yield of 3-D memories. Because the 2-D memories are stacked to form a 3-D memory, the repair status of the prebond is kept as the good status. However, if faults occur in the postbond on the same cells which were repaired in the prebond, they must be identified and repaired because they cannot be repaired by the previous methods. There is no research on the repair the same faulty cells which occur in the prebond and postbond yet. Therefore, the new 3-D fuse architecture is proposed to repair the faulty cells which occur in the prebond and postbond. The redundancies which repair the faulty cells in the prebond are invalidated. The faulty cells are repaired by other redundancies in the postbond by the proposed 3-D fuse architecture. Thus, the proposed technique can improve the yield of 3-D memories. The experimental results show that the proposed technique can achieve higher yields of 3-D memories because only the proposed technique can repair the same faulty cells occurring in the prebond and postbond, and verify the good repair status of the 3-D memories.",
author = "Wooheon Kang and Changwook Lee and Hyunyul Lim and Sungho Kang",
year = "2016",
month = "10",
day = "1",
doi = "10.1109/TCAD.2016.2523444",
language = "English",
volume = "35",
pages = "1763--1767",
journal = "IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems",
issn = "0278-0070",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "10",

}

A New 3-D Fuse Architecture to Improve Yield of 3-D Memories. / Kang, Wooheon; Lee, Changwook; Lim, Hyunyul; Kang, Sungho.

In: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 35, No. 10, 7395326, 01.10.2016, p. 1763-1767.

Research output: Contribution to journalArticle

TY - JOUR

T1 - A New 3-D Fuse Architecture to Improve Yield of 3-D Memories

AU - Kang, Wooheon

AU - Lee, Changwook

AU - Lim, Hyunyul

AU - Kang, Sungho

PY - 2016/10/1

Y1 - 2016/10/1

N2 - A new 3-D fuse architecture is proposed to improve the yield of 3-D memories. Because the 2-D memories are stacked to form a 3-D memory, the repair status of the prebond is kept as the good status. However, if faults occur in the postbond on the same cells which were repaired in the prebond, they must be identified and repaired because they cannot be repaired by the previous methods. There is no research on the repair the same faulty cells which occur in the prebond and postbond yet. Therefore, the new 3-D fuse architecture is proposed to repair the faulty cells which occur in the prebond and postbond. The redundancies which repair the faulty cells in the prebond are invalidated. The faulty cells are repaired by other redundancies in the postbond by the proposed 3-D fuse architecture. Thus, the proposed technique can improve the yield of 3-D memories. The experimental results show that the proposed technique can achieve higher yields of 3-D memories because only the proposed technique can repair the same faulty cells occurring in the prebond and postbond, and verify the good repair status of the 3-D memories.

AB - A new 3-D fuse architecture is proposed to improve the yield of 3-D memories. Because the 2-D memories are stacked to form a 3-D memory, the repair status of the prebond is kept as the good status. However, if faults occur in the postbond on the same cells which were repaired in the prebond, they must be identified and repaired because they cannot be repaired by the previous methods. There is no research on the repair the same faulty cells which occur in the prebond and postbond yet. Therefore, the new 3-D fuse architecture is proposed to repair the faulty cells which occur in the prebond and postbond. The redundancies which repair the faulty cells in the prebond are invalidated. The faulty cells are repaired by other redundancies in the postbond by the proposed 3-D fuse architecture. Thus, the proposed technique can improve the yield of 3-D memories. The experimental results show that the proposed technique can achieve higher yields of 3-D memories because only the proposed technique can repair the same faulty cells occurring in the prebond and postbond, and verify the good repair status of the 3-D memories.

UR - http://www.scopus.com/inward/record.url?scp=84988039698&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84988039698&partnerID=8YFLogxK

U2 - 10.1109/TCAD.2016.2523444

DO - 10.1109/TCAD.2016.2523444

M3 - Article

VL - 35

SP - 1763

EP - 1767

JO - IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

JF - IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

SN - 0278-0070

IS - 10

M1 - 7395326

ER -