A new approach to zero shrinkage LTCC

Yong Jun Seo, Yong Soo Cho

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Several approaches have been introduced to produce zero x-y shrinkage of LTCC (Low Temperature Co-fired Ceramics) after co-firing in a conventional conveyor furnace. These techniques require additional experimental procedure to control shrinkage with better tolerance and/or to eliminate the so-called release tape through mechanical scrubbing. The release tape acts as a constraining layer during sintering by utilizing highly refractive materials such as alumina or zirconia as a main constituent of the tape. Recent reports revealed that un-sacrificial or internal constraining tape can be laminated with regular tape for subsequent zero x-y shrinkage. This work first demonstrates a new approach of producing zero x-y shrinkage without any additional sacrificial or un-sacrificial layer. This new approach is based on new LTCC composition consisting of novel glass and ceramic filler. Mechanism of the zero-shrinkage is associated with chemical reactions between tape constituents during firing. Carefully-designed LTCC materials integrated with Ag-based conductors have successfully demonstrated that the production of zero x-y shrinkage is reliable with competitive performance under common firing conditions such as 850-900°C and air-firing. Dielectric and physical properties changed depending on glass composition that determines the chemical reactivity and densification behavior. Dielectric constants of 4.0-9.0 and loss tangents of < 0.05 were typical values for the new zero shrinkage LTCC.

Original languageEnglish
Title of host publicationIMAPS/ACerS - 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006
Pages372-375
Number of pages4
Publication statusPublished - 2006
Event2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006 - Denver, CO, United States
Duration: 2006 Apr 242006 Apr 27

Publication series

NameIMAPS/ACerS - 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006

Other

Other2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006
CountryUnited States
CityDenver, CO
Period06/4/2406/4/27

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Ceramics and Composites

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