Fingerprint
Dive into the research topics of 'A new repair scheme for TSV-based 3D memory using base die repair cells'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
A new repair scheme for TSV-based 3D memory using base die repair cells
Donghyun Han, Hayoung Lee, Donghyun Kim, Sungho Kang
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1
Citation
(Scopus)