A new TSV set architecture for high reliability

Jaeseok Park, Sungho Kang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Recently, 3D IC design is a very attracting issue, and the importance of system reliability increases. This paper proposes a new reliable and repairable TSV set architecture. The proposed architecture supports the previous TSV repair scheme using TSV redundancies and provides a defect/error detection function reutilizing residual TSV redundancies for high reliability of 3D ICs. This can be applied to both online test and soft error detection/analysis. The results show that the proposed TSV set architecture guarantees high TSV redundancy efficiency and reliability. And, the results show that the proposed TSV architecture achieves defect/error coverages which are steady and predictable by a simple formula.

Original languageEnglish
Title of host publicationProceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013
PublisherIEEE Computer Society
Pages123-126
Number of pages4
ISBN (Print)9781479913145
DOIs
Publication statusPublished - 2013 Jan 1
Event5th Asia Symposium on Quality Electronic Design, ASQED 2013 - Penang, Malaysia
Duration: 2013 Aug 262013 Aug 28

Other

Other5th Asia Symposium on Quality Electronic Design, ASQED 2013
CountryMalaysia
CityPenang
Period13/8/2613/8/28

    Fingerprint

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Cite this

Park, J., & Kang, S. (2013). A new TSV set architecture for high reliability. In Proceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013 (pp. 123-126). [6643574] IEEE Computer Society. https://doi.org/10.1109/ASQED.2013.6643574