A new TSV set architecture for high reliability

Jaeseok Park, Sungho Kang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Recently, 3D IC design is a very attracting issue, and the importance of system reliability increases. This paper proposes a new reliable and repairable TSV set architecture. The proposed architecture supports the previous TSV repair scheme using TSV redundancies and provides a defect/error detection function reutilizing residual TSV redundancies for high reliability of 3D ICs. This can be applied to both online test and soft error detection/analysis. The results show that the proposed TSV set architecture guarantees high TSV redundancy efficiency and reliability. And, the results show that the proposed TSV architecture achieves defect/error coverages which are steady and predictable by a simple formula.

Original languageEnglish
Title of host publicationProceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013
PublisherIEEE Computer Society
Pages123-126
Number of pages4
ISBN (Print)9781479913145
DOIs
Publication statusPublished - 2013 Jan 1
Event5th Asia Symposium on Quality Electronic Design, ASQED 2013 - Penang, Malaysia
Duration: 2013 Aug 262013 Aug 28

Other

Other5th Asia Symposium on Quality Electronic Design, ASQED 2013
CountryMalaysia
CityPenang
Period13/8/2613/8/28

Fingerprint

Redundancy
Error detection
Defects
Repair
Integrated circuit design

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Cite this

Park, J., & Kang, S. (2013). A new TSV set architecture for high reliability. In Proceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013 (pp. 123-126). [6643574] IEEE Computer Society. https://doi.org/10.1109/ASQED.2013.6643574
Park, Jaeseok ; Kang, Sungho. / A new TSV set architecture for high reliability. Proceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013. IEEE Computer Society, 2013. pp. 123-126
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Park, J & Kang, S 2013, A new TSV set architecture for high reliability. in Proceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013., 6643574, IEEE Computer Society, pp. 123-126, 5th Asia Symposium on Quality Electronic Design, ASQED 2013, Penang, Malaysia, 13/8/26. https://doi.org/10.1109/ASQED.2013.6643574

A new TSV set architecture for high reliability. / Park, Jaeseok; Kang, Sungho.

Proceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013. IEEE Computer Society, 2013. p. 123-126 6643574.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Park J, Kang S. A new TSV set architecture for high reliability. In Proceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013. IEEE Computer Society. 2013. p. 123-126. 6643574 https://doi.org/10.1109/ASQED.2013.6643574