A new TSV set architecture for high reliability

Jaeseok Park, Sungho Kang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Recently, 3D IC design is a very attracting issue, and the importance of system reliability increases. This paper proposes a new reliable and repairable TSV set architecture. The proposed architecture supports the previous TSV repair scheme using TSV redundancies and provides a defect/error detection function reutilizing residual TSV redundancies for high reliability of 3D ICs. This can be applied to both online test and soft error detection/analysis. The results show that the proposed TSV set architecture guarantees high TSV redundancy efficiency and reliability. And, the results show that the proposed TSV architecture achieves defect/error coverages which are steady and predictable by a simple formula.

Original languageEnglish
Title of host publicationProceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013
PublisherIEEE Computer Society
Pages123-126
Number of pages4
ISBN (Print)9781479913145
DOIs
Publication statusPublished - 2013
Event5th Asia Symposium on Quality Electronic Design, ASQED 2013 - Penang, Malaysia
Duration: 2013 Aug 262013 Aug 28

Publication series

NameProceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013

Other

Other5th Asia Symposium on Quality Electronic Design, ASQED 2013
CountryMalaysia
CityPenang
Period13/8/2613/8/28

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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  • Cite this

    Park, J., & Kang, S. (2013). A new TSV set architecture for high reliability. In Proceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013 (pp. 123-126). [6643574] (Proceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013). IEEE Computer Society. https://doi.org/10.1109/ASQED.2013.6643574