A novel CPW structure for high-speed interconnects

S. J. Yoon; S. H. Jeong; J. G. Yook; Y. J. Kim; S. G. Lee; O. K. Seo; K. S. Lim; D. S. Kim

doi:10.1109/MWSYM.2001.967006

A novel CPW structure for high-speed interconnects

S. J. Yoon, S. H. Jeong, J. G. Yook, Y. J. Kim, S. G. Lee, O. K. Seo, K. S. Lim, D. S. Kim

Department of Electrical and Electronic Engineering

Research output: Contribution to journal › Article › peer-review

16 Citations (Scopus)

Abstract

For high-speed digital circuits a novel elevated-CPW (ECPW) structure with low loss and low dispersion is proposed and the performances are well compared with the theoretical prediction. The ECPW is designed with the aid of time domain fullwave FDTD technique and is fabricated using conventional thick-film MEMS processing. Proposed structure reveal at least 10dB lower insertion loss compared to conventional CPW geometries and effective permittivity is 4 to 6 times smaller than that of conventional CPW. Characteristic impedances and effective permittivities are given for various geometrical parameters.

Original language	English
Pages (from-to)	771-774
Number of pages	4
Journal	IEEE MTT-S International Microwave Symposium Digest
Volume	2
DOIs	https://doi.org/10.1109/MWSYM.2001.967006
Publication status	Published - 2001

All Science Journal Classification (ASJC) codes

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1109/MWSYM.2001.967006

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author = "Yoon, {S. J.} and Jeong, {S. H.} and Yook, {J. G.} and Kim, {Y. J.} and Lee, {S. G.} and Seo, {O. K.} and Lim, {K. S.} and Kim, {D. S.}",

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AU - Yoon, S. J.

AU - Jeong, S. H.

AU - Yook, J. G.

AU - Kim, Y. J.

AU - Lee, S. G.

AU - Seo, O. K.

AU - Lim, K. S.

AU - Kim, D. S.

PY - 2001

Y1 - 2001

N2 - For high-speed digital circuits a novel elevated-CPW (ECPW) structure with low loss and low dispersion is proposed and the performances are well compared with the theoretical prediction. The ECPW is designed with the aid of time domain fullwave FDTD technique and is fabricated using conventional thick-film MEMS processing. Proposed structure reveal at least 10dB lower insertion loss compared to conventional CPW geometries and effective permittivity is 4 to 6 times smaller than that of conventional CPW. Characteristic impedances and effective permittivities are given for various geometrical parameters.

AB - For high-speed digital circuits a novel elevated-CPW (ECPW) structure with low loss and low dispersion is proposed and the performances are well compared with the theoretical prediction. The ECPW is designed with the aid of time domain fullwave FDTD technique and is fabricated using conventional thick-film MEMS processing. Proposed structure reveal at least 10dB lower insertion loss compared to conventional CPW geometries and effective permittivity is 4 to 6 times smaller than that of conventional CPW. Characteristic impedances and effective permittivities are given for various geometrical parameters.

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JF - IEEE MTT-S International Microwave Symposium Digest

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A novel CPW structure for high-speed interconnects

Abstract

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