A novel power plane topology for wideband suppression of simultaneous switching noise and fast computational method

Hee Do Kang, Hyun Kim, Sang Gyu Kim, Jong Gwan Yook

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Using spiral resonator mounted on a power plane, simultaneous switching noise and ground bouncing noise can be suppressed through very wideband from 0.22 GHz to 12.5 GHz under noise suppression margin of -25 dB. The area of diameter of 3.2 mm is necessary for the resonator, and is comparable to a clearance pad size, diameter of 3.0 mm, in a ground/power plane. Hence the small size makes discontinuity of return current path reduces, therefore the signal integrity problem of an electromagnetic bandgap structure can be improved. For the analysis of modeling, the effects of inductance and capacitance in the spiral resonator are analyzed. As a result, suppression bandwidth and resonance frequency can be easily controlled by arm length and gap of spiral. Moreover, by applying 2 different sizes of resonators on top and bottom of power via, it is identified that multi-resonance effect is also obtained. Finally, it is shown that computational time can be dramatically decreased using both transmission line method and three-dimensional electromagnetic (3D EM) simulation instead of only 3D EM simulation for analysis.

Original languageEnglish
Title of host publication2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 - Shatin, Hong Kong, China
Duration: 2009 Dec 22009 Dec 4

Publication series

Name2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009

Other

Other2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
CountryChina
CityShatin, Hong Kong
Period09/12/209/12/4

Fingerprint

Computational methods
Resonators
Topology
Inductance
Electric lines
Energy gap
Capacitance
Bandwidth

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Kang, H. D., Kim, H., Kim, S. G., & Yook, J. G. (2009). A novel power plane topology for wideband suppression of simultaneous switching noise and fast computational method. In 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 [5403991] (2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009). https://doi.org/10.1109/EDAPS.2009.5403991
Kang, Hee Do ; Kim, Hyun ; Kim, Sang Gyu ; Yook, Jong Gwan. / A novel power plane topology for wideband suppression of simultaneous switching noise and fast computational method. 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009. 2009. (2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009).
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Kang, HD, Kim, H, Kim, SG & Yook, JG 2009, A novel power plane topology for wideband suppression of simultaneous switching noise and fast computational method. in 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009., 5403991, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, Shatin, Hong Kong, China, 09/12/2. https://doi.org/10.1109/EDAPS.2009.5403991

A novel power plane topology for wideband suppression of simultaneous switching noise and fast computational method. / Kang, Hee Do; Kim, Hyun; Kim, Sang Gyu; Yook, Jong Gwan.

2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009. 2009. 5403991 (2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Kang HD, Kim H, Kim SG, Yook JG. A novel power plane topology for wideband suppression of simultaneous switching noise and fast computational method. In 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009. 2009. 5403991. (2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009). https://doi.org/10.1109/EDAPS.2009.5403991