A novel synthesis method for an open-cell microsponge polyimide for heat insulation

Jinuk Kwon, Jinyoung Kim, Dongmyung Park, Haksoo Han

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

A novel method for synthesizing a microsponge polyimide (PI) film with excellent thermal stability, chemical resistance, and heat insulation performance was developed. The synthesized microsponge PI film has open cells with sizes between 1 and 10 μm and a porosity of 76%. Furthermore, the film contains several layers overlapping in multiple grid structures, which complicates the heat transfer paths. Thus, the heat transfer coefficient of the microsponge PI film is 67% less than that of existing polyimide film (0.054 vs. 0.16 W/m·K). This reduced heat transfer coefficient results in excellent heat insulation performance of the microsponge PI film. The thermal decomposition (pyrolysis) of the microsponge PI starts at 498 °C and its glass transition temperature is 317 °C, which indicates excellent thermal stability. However, its Young's modulus, an indicator of mechanical strength, is nearly 74% less than that of conventional PI film (26 vs. 100.2 MPa).

Original languageEnglish
Pages (from-to)68-72
Number of pages5
JournalPolymer
Volume56
DOIs
Publication statusPublished - 2015 Jan 15

Fingerprint

Thermal insulation
Polyimides
Heat transfer coefficients
Pyrolysis
Thermodynamic stability
Chemical resistance
Strength of materials
Porosity
Elastic moduli
Heat transfer

All Science Journal Classification (ASJC) codes

  • Organic Chemistry
  • Polymers and Plastics

Cite this

Kwon, Jinuk ; Kim, Jinyoung ; Park, Dongmyung ; Han, Haksoo. / A novel synthesis method for an open-cell microsponge polyimide for heat insulation. In: Polymer. 2015 ; Vol. 56. pp. 68-72.
@article{c42edba4b85144b89d608d7615c46178,
title = "A novel synthesis method for an open-cell microsponge polyimide for heat insulation",
abstract = "A novel method for synthesizing a microsponge polyimide (PI) film with excellent thermal stability, chemical resistance, and heat insulation performance was developed. The synthesized microsponge PI film has open cells with sizes between 1 and 10 μm and a porosity of 76{\%}. Furthermore, the film contains several layers overlapping in multiple grid structures, which complicates the heat transfer paths. Thus, the heat transfer coefficient of the microsponge PI film is 67{\%} less than that of existing polyimide film (0.054 vs. 0.16 W/m·K). This reduced heat transfer coefficient results in excellent heat insulation performance of the microsponge PI film. The thermal decomposition (pyrolysis) of the microsponge PI starts at 498 °C and its glass transition temperature is 317 °C, which indicates excellent thermal stability. However, its Young's modulus, an indicator of mechanical strength, is nearly 74{\%} less than that of conventional PI film (26 vs. 100.2 MPa).",
author = "Jinuk Kwon and Jinyoung Kim and Dongmyung Park and Haksoo Han",
year = "2015",
month = "1",
day = "15",
doi = "10.1016/j.polymer.2014.06.090",
language = "English",
volume = "56",
pages = "68--72",
journal = "Polymer",
issn = "0032-3861",
publisher = "Elsevier BV",

}

A novel synthesis method for an open-cell microsponge polyimide for heat insulation. / Kwon, Jinuk; Kim, Jinyoung; Park, Dongmyung; Han, Haksoo.

In: Polymer, Vol. 56, 15.01.2015, p. 68-72.

Research output: Contribution to journalArticle

TY - JOUR

T1 - A novel synthesis method for an open-cell microsponge polyimide for heat insulation

AU - Kwon, Jinuk

AU - Kim, Jinyoung

AU - Park, Dongmyung

AU - Han, Haksoo

PY - 2015/1/15

Y1 - 2015/1/15

N2 - A novel method for synthesizing a microsponge polyimide (PI) film with excellent thermal stability, chemical resistance, and heat insulation performance was developed. The synthesized microsponge PI film has open cells with sizes between 1 and 10 μm and a porosity of 76%. Furthermore, the film contains several layers overlapping in multiple grid structures, which complicates the heat transfer paths. Thus, the heat transfer coefficient of the microsponge PI film is 67% less than that of existing polyimide film (0.054 vs. 0.16 W/m·K). This reduced heat transfer coefficient results in excellent heat insulation performance of the microsponge PI film. The thermal decomposition (pyrolysis) of the microsponge PI starts at 498 °C and its glass transition temperature is 317 °C, which indicates excellent thermal stability. However, its Young's modulus, an indicator of mechanical strength, is nearly 74% less than that of conventional PI film (26 vs. 100.2 MPa).

AB - A novel method for synthesizing a microsponge polyimide (PI) film with excellent thermal stability, chemical resistance, and heat insulation performance was developed. The synthesized microsponge PI film has open cells with sizes between 1 and 10 μm and a porosity of 76%. Furthermore, the film contains several layers overlapping in multiple grid structures, which complicates the heat transfer paths. Thus, the heat transfer coefficient of the microsponge PI film is 67% less than that of existing polyimide film (0.054 vs. 0.16 W/m·K). This reduced heat transfer coefficient results in excellent heat insulation performance of the microsponge PI film. The thermal decomposition (pyrolysis) of the microsponge PI starts at 498 °C and its glass transition temperature is 317 °C, which indicates excellent thermal stability. However, its Young's modulus, an indicator of mechanical strength, is nearly 74% less than that of conventional PI film (26 vs. 100.2 MPa).

UR - http://www.scopus.com/inward/record.url?scp=84921303933&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84921303933&partnerID=8YFLogxK

U2 - 10.1016/j.polymer.2014.06.090

DO - 10.1016/j.polymer.2014.06.090

M3 - Article

AN - SCOPUS:84921303933

VL - 56

SP - 68

EP - 72

JO - Polymer

JF - Polymer

SN - 0032-3861

ER -