Abstract
A novel method for synthesizing a microsponge polyimide (PI) film with excellent thermal stability, chemical resistance, and heat insulation performance was developed. The synthesized microsponge PI film has open cells with sizes between 1 and 10 μm and a porosity of 76%. Furthermore, the film contains several layers overlapping in multiple grid structures, which complicates the heat transfer paths. Thus, the heat transfer coefficient of the microsponge PI film is 67% less than that of existing polyimide film (0.054 vs. 0.16 W/m·K). This reduced heat transfer coefficient results in excellent heat insulation performance of the microsponge PI film. The thermal decomposition (pyrolysis) of the microsponge PI starts at 498 °C and its glass transition temperature is 317 °C, which indicates excellent thermal stability. However, its Young's modulus, an indicator of mechanical strength, is nearly 74% less than that of conventional PI film (26 vs. 100.2 MPa).
| Original language | English |
|---|---|
| Pages (from-to) | 68-72 |
| Number of pages | 5 |
| Journal | Polymer |
| Volume | 56 |
| DOIs | |
| Publication status | Published - 2015 Jan 15 |
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All Science Journal Classification (ASJC) codes
- Organic Chemistry
- Polymers and Plastics
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A novel synthesis method for an open-cell microsponge polyimide for heat insulation. / Kwon, Jinuk; Kim, Jinyoung; Park, Dongmyung; Han, Haksoo.
In: Polymer, Vol. 56, 15.01.2015, p. 68-72.Research output: Contribution to journal › Article
TY - JOUR
T1 - A novel synthesis method for an open-cell microsponge polyimide for heat insulation
AU - Kwon, Jinuk
AU - Kim, Jinyoung
AU - Park, Dongmyung
AU - Han, Haksoo
PY - 2015/1/15
Y1 - 2015/1/15
N2 - A novel method for synthesizing a microsponge polyimide (PI) film with excellent thermal stability, chemical resistance, and heat insulation performance was developed. The synthesized microsponge PI film has open cells with sizes between 1 and 10 μm and a porosity of 76%. Furthermore, the film contains several layers overlapping in multiple grid structures, which complicates the heat transfer paths. Thus, the heat transfer coefficient of the microsponge PI film is 67% less than that of existing polyimide film (0.054 vs. 0.16 W/m·K). This reduced heat transfer coefficient results in excellent heat insulation performance of the microsponge PI film. The thermal decomposition (pyrolysis) of the microsponge PI starts at 498 °C and its glass transition temperature is 317 °C, which indicates excellent thermal stability. However, its Young's modulus, an indicator of mechanical strength, is nearly 74% less than that of conventional PI film (26 vs. 100.2 MPa).
AB - A novel method for synthesizing a microsponge polyimide (PI) film with excellent thermal stability, chemical resistance, and heat insulation performance was developed. The synthesized microsponge PI film has open cells with sizes between 1 and 10 μm and a porosity of 76%. Furthermore, the film contains several layers overlapping in multiple grid structures, which complicates the heat transfer paths. Thus, the heat transfer coefficient of the microsponge PI film is 67% less than that of existing polyimide film (0.054 vs. 0.16 W/m·K). This reduced heat transfer coefficient results in excellent heat insulation performance of the microsponge PI film. The thermal decomposition (pyrolysis) of the microsponge PI starts at 498 °C and its glass transition temperature is 317 °C, which indicates excellent thermal stability. However, its Young's modulus, an indicator of mechanical strength, is nearly 74% less than that of conventional PI film (26 vs. 100.2 MPa).
UR - http://www.scopus.com/inward/record.url?scp=84921303933&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84921303933&partnerID=8YFLogxK
U2 - 10.1016/j.polymer.2014.06.090
DO - 10.1016/j.polymer.2014.06.090
M3 - Article
AN - SCOPUS:84921303933
VL - 56
SP - 68
EP - 72
JO - Polymer
JF - Polymer
SN - 0032-3861
ER -