Bleeding control is very important during operations and surgical treatments of wounds and traumatic injuries. This need has led to development and practical uses of various hemostatic agents. However, the currently available hemostatic agents have several limitations related to biocompatibility and hemostatic performance due to the presence of cytotoxic and immunogenic components and the individual differences in the blood coagulation system. In this study, a hydrogel system inspired by a blood clotting mediator in platelets was developed as a new class of hemostatic adhesive with improved performance and multi-functionality. The proposed hydrogel system was prepared using serotonin-conjugated hyaluronic acid, both of which are highly biocompatible as they are natural components of the body. Serotonin facilitates hemostasis by acting as a blood clotting mediator in platelets and acts as a crosslinker to form adhesive hydrogels. The serotonin-conjugated hyaluronic acid hydrogel exhibited significantly improved hemostatic capability in vivo with normal and hemophilic injuries compared with a commercially available fibrin-based hemostatic agent and prevented abnormal tissue adhesion after hemostasis. This hydrogel system, inspired by the platelet clotting mechanism, is a novel hemostatic adhesive that overcomes several limitations of existing hemostatic agents and could substantially improve bleeding control, thereby improving outcomes of surgical procedures.
Bibliographical noteFunding Information:
This work was supported by grants (2017R1A2B3005994 and 2018M3A9H1021382) from the National Research Foundation of Korea (NRF) funded by the Ministry of Science and ICT (MSIT), Republic of Korea. This work was also supported by the Institute for Basic Science (IBS-R026-D1). This work was also supported in part by the BK21 PLUS program.
© 2019 The Royal Society of Chemistry.
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Mechanics of Materials
- Process Chemistry and Technology
- Electrical and Electronic Engineering