A study on the no insulation winding method of the HTS coil

Sukjin Choi, Hyun Chul Jo, Young Jin Hwang, Seungyong Hahn, Tae Kuk Ko

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Abstract

This paper reports a study on BSCCO and ReBCO HTS (high temperature superconducting) test coils, layer-wound and double-pancake, with and without turn-to-turn insulation. Over current tests were performed in a bath of liquid nitrogen to compare stabilities of the test coils at 77 K. Saturation of magnetic fields from the NI (no insulation) coils, both BSCCO and ReBCO, was observed owing to current bypassing through turn-to-turn contacts in local quenches at operating currents higher than their critical currents. In the NI ReBCO coils, global quenches occurred at operating currents higher than the coil critical currents and quench recoveries were observed during discharge of the coils. The experimental results, obtained to date, demonstrate that the NI winding method enables remarkable improvement of thermal stability of the HTS coils.

Original languageEnglish
Article number6080707
JournalIEEE Transactions on Applied Superconductivity
Volume22
Issue number3
DOIs
Publication statusPublished - 2012

Bibliographical note

Funding Information:
Manuscript received September 13, 2011; accepted November 08, 2011. Date of publication November 14, 2011; date of current version May 24, 2012. This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MEST) under Grant 2011-0020401. S. Choi, H. C. Jo, Y. J. Hwang, and T. K. Ko are with the Yonsei University, Seoul 120-749, Korea (e-mail: tkko@yonsei.ac.kr). S. Hahn is with the Francis Bitter Magnet Laboratory, Massachusetts Institute of Technology, Cambridge, MA 02139 USA (e-mail: syhahn@mit.edu). Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TASC.2011.2175892

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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