A thin film thermoelectric cooler for chip-on-board assembly

Shiho Kim, Hyunju Lee, Namjae Kim, Jungho Yoo

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

We have proposed and demonstrated an embedded thin film thermoelectric cooler attached between die chip and metal plate for Chip-on-Board (COB) direct assembly. The proposed structure of COB cooler was modeled by electrical equivalent circuit for SPICE simulation including operational heat generation of chip and PWM control of input power supply. The optimum input power of the TEC to achieve maximum temperature difference between chip and heat sink was simulated by using the proposed equivalent circuit. The measured and simulated results offer the possibility of thin film active cooling for COB direct assembly.

Original languageEnglish
Pages (from-to)1615-1621
Number of pages7
Journalieice electronics express
Volume7
Issue number21
DOIs
Publication statusPublished - 2010 Nov 1

Fingerprint

coolers
Equivalent circuits
assembly
chips
Thin films
Plate metal
Heat generation
Heat sinks
SPICE
thin films
Pulse width modulation
Cooling
equivalent circuits
metal plates
pulse duration modulation
heat generation
heat sinks
sinks
power supplies
Temperature

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Kim, Shiho ; Lee, Hyunju ; Kim, Namjae ; Yoo, Jungho. / A thin film thermoelectric cooler for chip-on-board assembly. In: ieice electronics express. 2010 ; Vol. 7, No. 21. pp. 1615-1621.
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A thin film thermoelectric cooler for chip-on-board assembly. / Kim, Shiho; Lee, Hyunju; Kim, Namjae; Yoo, Jungho.

In: ieice electronics express, Vol. 7, No. 21, 01.11.2010, p. 1615-1621.

Research output: Contribution to journalArticle

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