A thin film thermoelectric cooler for chip-on-board assembly

Shiho Kim, Hyunju Lee, Namjae Kim, Jungho Yoo

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

We have proposed and demonstrated an embedded thin film thermoelectric cooler attached between die chip and metal plate for Chip-on-Board (COB) direct assembly. The proposed structure of COB cooler was modeled by electrical equivalent circuit for SPICE simulation including operational heat generation of chip and PWM control of input power supply. The optimum input power of the TEC to achieve maximum temperature difference between chip and heat sink was simulated by using the proposed equivalent circuit. The measured and simulated results offer the possibility of thin film active cooling for COB direct assembly.

Original languageEnglish
Pages (from-to)1615-1621
Number of pages7
Journalieice electronics express
Volume7
Issue number21
DOIs
Publication statusPublished - 2010 Nov

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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