TY - GEN
T1 - A thin film thermoelectric cooler for chip-on-board direct assembly
AU - Lee, Hyunju
AU - Park, Soonseo
AU - Cho, Sungkyu
AU - Kim, Hyojong
AU - Kim, Shiho
PY - 2009
Y1 - 2009
N2 - A thin film solid state cooler for COB direct assembly using supperlattice based thermoelectric material is reported. The embedded cooler attached between the die chip and metal plate can provide site-specific cooling as well as active on-demand cooling. This demonstration offers the possibility of thin film active cooling for the COB direct assembly. The high power density of chip-on-Board would be no longer be limited by cooling capability. This technology can be extended to the case of hot spot cooling for COB assembly that can be selectively switched on and off depending on which part of the chip is in critical need of cooling at any point of time.
AB - A thin film solid state cooler for COB direct assembly using supperlattice based thermoelectric material is reported. The embedded cooler attached between the die chip and metal plate can provide site-specific cooling as well as active on-demand cooling. This demonstration offers the possibility of thin film active cooling for the COB direct assembly. The high power density of chip-on-Board would be no longer be limited by cooling capability. This technology can be extended to the case of hot spot cooling for COB assembly that can be selectively switched on and off depending on which part of the chip is in critical need of cooling at any point of time.
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U2 - 10.1109/EDAPS.2009.5403990
DO - 10.1109/EDAPS.2009.5403990
M3 - Conference contribution
AN - SCOPUS:77950219484
SN - 9781424453504
T3 - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
BT - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
T2 - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
Y2 - 2 December 2009 through 4 December 2009
ER -