Abstract
A thin film solid state cooler for COB direct assembly using supperlattice based thermoelectric material is reported. The embedded cooler attached between the die chip and metal plate can provide site-specific cooling as well as active on-demand cooling. This demonstration offers the possibility of thin film active cooling for the COB direct assembly. The high power density of chip-on-Board would be no longer be limited by cooling capability. This technology can be extended to the case of hot spot cooling for COB assembly that can be selectively switched on and off depending on which part of the chip is in critical need of cooling at any point of time.
| Original language | English |
|---|---|
| Title of host publication | 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 |
| DOIs | |
| Publication status | Published - 2009 Dec 1 |
| Event | 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 - Shatin, Hong Kong, China Duration: 2009 Dec 2 → 2009 Dec 4 |
Other
| Other | 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 |
|---|---|
| Country | China |
| City | Shatin, Hong Kong |
| Period | 09/12/2 → 09/12/4 |
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All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering
Cite this
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A thin film thermoelectric cooler for chip-on-board direct assembly. / Lee, Hyunju; Park, Soonseo; Cho, Sungkyu; Kim, Hyojong; Kim, Shiho.
2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009. 2009. 5403990.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - A thin film thermoelectric cooler for chip-on-board direct assembly
AU - Lee, Hyunju
AU - Park, Soonseo
AU - Cho, Sungkyu
AU - Kim, Hyojong
AU - Kim, Shiho
PY - 2009/12/1
Y1 - 2009/12/1
N2 - A thin film solid state cooler for COB direct assembly using supperlattice based thermoelectric material is reported. The embedded cooler attached between the die chip and metal plate can provide site-specific cooling as well as active on-demand cooling. This demonstration offers the possibility of thin film active cooling for the COB direct assembly. The high power density of chip-on-Board would be no longer be limited by cooling capability. This technology can be extended to the case of hot spot cooling for COB assembly that can be selectively switched on and off depending on which part of the chip is in critical need of cooling at any point of time.
AB - A thin film solid state cooler for COB direct assembly using supperlattice based thermoelectric material is reported. The embedded cooler attached between the die chip and metal plate can provide site-specific cooling as well as active on-demand cooling. This demonstration offers the possibility of thin film active cooling for the COB direct assembly. The high power density of chip-on-Board would be no longer be limited by cooling capability. This technology can be extended to the case of hot spot cooling for COB assembly that can be selectively switched on and off depending on which part of the chip is in critical need of cooling at any point of time.
UR - http://www.scopus.com/inward/record.url?scp=77950219484&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77950219484&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2009.5403990
DO - 10.1109/EDAPS.2009.5403990
M3 - Conference contribution
SN - 9781424453504
BT - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
ER -