A thin film thermoelectric cooler for chip-on-board direct assembly

Hyunju Lee, Soonseo Park, Sungkyu Cho, Hyojong Kim, Shiho Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

A thin film solid state cooler for COB direct assembly using supperlattice based thermoelectric material is reported. The embedded cooler attached between the die chip and metal plate can provide site-specific cooling as well as active on-demand cooling. This demonstration offers the possibility of thin film active cooling for the COB direct assembly. The high power density of chip-on-Board would be no longer be limited by cooling capability. This technology can be extended to the case of hot spot cooling for COB assembly that can be selectively switched on and off depending on which part of the chip is in critical need of cooling at any point of time.

Original languageEnglish
Title of host publication2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 - Shatin, Hong Kong, China
Duration: 2009 Dec 22009 Dec 4

Other

Other2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
CountryChina
CityShatin, Hong Kong
Period09/12/209/12/4

Fingerprint

Cooling
Thin films
Plate metal
Demonstrations

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Lee, H., Park, S., Cho, S., Kim, H., & Kim, S. (2009). A thin film thermoelectric cooler for chip-on-board direct assembly. In 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 [5403990] https://doi.org/10.1109/EDAPS.2009.5403990
Lee, Hyunju ; Park, Soonseo ; Cho, Sungkyu ; Kim, Hyojong ; Kim, Shiho. / A thin film thermoelectric cooler for chip-on-board direct assembly. 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009. 2009.
@inproceedings{375fd42d5af247558ec0aec03a2f50a3,
title = "A thin film thermoelectric cooler for chip-on-board direct assembly",
abstract = "A thin film solid state cooler for COB direct assembly using supperlattice based thermoelectric material is reported. The embedded cooler attached between the die chip and metal plate can provide site-specific cooling as well as active on-demand cooling. This demonstration offers the possibility of thin film active cooling for the COB direct assembly. The high power density of chip-on-Board would be no longer be limited by cooling capability. This technology can be extended to the case of hot spot cooling for COB assembly that can be selectively switched on and off depending on which part of the chip is in critical need of cooling at any point of time.",
author = "Hyunju Lee and Soonseo Park and Sungkyu Cho and Hyojong Kim and Shiho Kim",
year = "2009",
month = "12",
day = "1",
doi = "10.1109/EDAPS.2009.5403990",
language = "English",
isbn = "9781424453504",
booktitle = "2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009",

}

Lee, H, Park, S, Cho, S, Kim, H & Kim, S 2009, A thin film thermoelectric cooler for chip-on-board direct assembly. in 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009., 5403990, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, Shatin, Hong Kong, China, 09/12/2. https://doi.org/10.1109/EDAPS.2009.5403990

A thin film thermoelectric cooler for chip-on-board direct assembly. / Lee, Hyunju; Park, Soonseo; Cho, Sungkyu; Kim, Hyojong; Kim, Shiho.

2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009. 2009. 5403990.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - A thin film thermoelectric cooler for chip-on-board direct assembly

AU - Lee, Hyunju

AU - Park, Soonseo

AU - Cho, Sungkyu

AU - Kim, Hyojong

AU - Kim, Shiho

PY - 2009/12/1

Y1 - 2009/12/1

N2 - A thin film solid state cooler for COB direct assembly using supperlattice based thermoelectric material is reported. The embedded cooler attached between the die chip and metal plate can provide site-specific cooling as well as active on-demand cooling. This demonstration offers the possibility of thin film active cooling for the COB direct assembly. The high power density of chip-on-Board would be no longer be limited by cooling capability. This technology can be extended to the case of hot spot cooling for COB assembly that can be selectively switched on and off depending on which part of the chip is in critical need of cooling at any point of time.

AB - A thin film solid state cooler for COB direct assembly using supperlattice based thermoelectric material is reported. The embedded cooler attached between the die chip and metal plate can provide site-specific cooling as well as active on-demand cooling. This demonstration offers the possibility of thin film active cooling for the COB direct assembly. The high power density of chip-on-Board would be no longer be limited by cooling capability. This technology can be extended to the case of hot spot cooling for COB assembly that can be selectively switched on and off depending on which part of the chip is in critical need of cooling at any point of time.

UR - http://www.scopus.com/inward/record.url?scp=77950219484&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77950219484&partnerID=8YFLogxK

U2 - 10.1109/EDAPS.2009.5403990

DO - 10.1109/EDAPS.2009.5403990

M3 - Conference contribution

SN - 9781424453504

BT - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009

ER -

Lee H, Park S, Cho S, Kim H, Kim S. A thin film thermoelectric cooler for chip-on-board direct assembly. In 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009. 2009. 5403990 https://doi.org/10.1109/EDAPS.2009.5403990