A thin film thermoelectric cooler for chip-on-board direct assembly

Hyunju Lee; Soonseo Park; Sungkyu Cho; Hyojong Kim; Shiho Kim

doi:10.1109/EDAPS.2009.5403990

A thin film thermoelectric cooler for chip-on-board direct assembly

Hyunju Lee, Soonseo Park, Sungkyu Cho, Hyojong Kim, Shiho Kim

School of Integrated Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

A thin film solid state cooler for COB direct assembly using supperlattice based thermoelectric material is reported. The embedded cooler attached between the die chip and metal plate can provide site-specific cooling as well as active on-demand cooling. This demonstration offers the possibility of thin film active cooling for the COB direct assembly. The high power density of chip-on-Board would be no longer be limited by cooling capability. This technology can be extended to the case of hot spot cooling for COB assembly that can be selectively switched on and off depending on which part of the chip is in critical need of cooling at any point of time.

Original language	English
Title of host publication	2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
DOIs	https://doi.org/10.1109/EDAPS.2009.5403990
Publication status	Published - 2009
Event	2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 - Shatin, Hong Kong, China Duration: 2009 Dec 2 → 2009 Dec 4

Publication series

Name	2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009

Other

Other	2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
Country	China
City	Shatin, Hong Kong
Period	09/12/2 → 09/12/4

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/EDAPS.2009.5403990

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Cite this

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title = "A thin film thermoelectric cooler for chip-on-board direct assembly",

abstract = "A thin film solid state cooler for COB direct assembly using supperlattice based thermoelectric material is reported. The embedded cooler attached between the die chip and metal plate can provide site-specific cooling as well as active on-demand cooling. This demonstration offers the possibility of thin film active cooling for the COB direct assembly. The high power density of chip-on-Board would be no longer be limited by cooling capability. This technology can be extended to the case of hot spot cooling for COB assembly that can be selectively switched on and off depending on which part of the chip is in critical need of cooling at any point of time.",

author = "Hyunju Lee and Soonseo Park and Sungkyu Cho and Hyojong Kim and Shiho Kim",

note = "Copyright: Copyright 2010 Elsevier B.V., All rights reserved.; 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 ; Conference date: 02-12-2009 Through 04-12-2009",

year = "2009",

doi = "10.1109/EDAPS.2009.5403990",

language = "English",

isbn = "9781424453504",

series = "2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009",

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Lee, H, Park, S, Cho, S, Kim, H & Kim, S 2009, A thin film thermoelectric cooler for chip-on-board direct assembly. in 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009., 5403990, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, Shatin, Hong Kong, China, 09/12/2. https://doi.org/10.1109/EDAPS.2009.5403990

A thin film thermoelectric cooler for chip-on-board direct assembly. / Lee, Hyunju; Park, Soonseo; Cho, Sungkyu; Kim, Hyojong; Kim, Shiho.

2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009. 2009. 5403990 (2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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