A throughput study for channel bonding in IEEE 802.11ac networks

Mun Suk Kim, Tanguy Ropitault, Sukyoung Lee, Nada Golmie

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Several analytical models for the channel bonding feature of IEEE 802.11ac have previously been presented for performance estimation, but their accuracy has been limited by the assumptions that there are no collisions or all nodes are in saturated state. Therefore, in this letter, we develop an analytical model for the throughput performance of channel bonding in IEEE 802.11ac, considering the presence of collisions under both saturated and non-saturated traffic loads, and our numerical results were validated by a simulation study.

Original languageEnglish
Pages (from-to)2682-2685
Number of pages4
JournalIEEE Communications Letters
Volume21
Issue number12
DOIs
Publication statusPublished - 2017 Dec 1

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Analytical Model
Analytical models
Throughput
Collision
Traffic
Simulation Study
Numerical Results
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All Science Journal Classification (ASJC) codes

  • Modelling and Simulation
  • Computer Science Applications
  • Electrical and Electronic Engineering

Cite this

Kim, Mun Suk ; Ropitault, Tanguy ; Lee, Sukyoung ; Golmie, Nada. / A throughput study for channel bonding in IEEE 802.11ac networks. In: IEEE Communications Letters. 2017 ; Vol. 21, No. 12. pp. 2682-2685.
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A throughput study for channel bonding in IEEE 802.11ac networks. / Kim, Mun Suk; Ropitault, Tanguy; Lee, Sukyoung; Golmie, Nada.

In: IEEE Communications Letters, Vol. 21, No. 12, 01.12.2017, p. 2682-2685.

Research output: Contribution to journalArticle

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