A throughput study for channel bonding in IEEE 802.11ac networks

Mun Suk Kim, Tanguy Ropitault, Sukyoung Lee, Nada Golmie

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)

Abstract

Several analytical models for the channel bonding feature of IEEE 802.11ac have previously been presented for performance estimation, but their accuracy has been limited by the assumptions that there are no collisions or all nodes are in saturated state. Therefore, in this letter, we develop an analytical model for the throughput performance of channel bonding in IEEE 802.11ac, considering the presence of collisions under both saturated and non-saturated traffic loads, and our numerical results were validated by a simulation study.

Original languageEnglish
Pages (from-to)2682-2685
Number of pages4
JournalIEEE Communications Letters
Volume21
Issue number12
DOIs
Publication statusPublished - 2017 Dec

Bibliographical note

Funding Information:
Manuscript received June 12, 2017; revised August 8, 2017; accepted August 24, 2017. Date of publication August 31, 2017; date of current version December 8, 2017. This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning (NRF-2017R1A2B4002000). The associate editor coordinating the review of this letter and approving it for publication was B. Rong. (Corresponding author: Sukyoung Lee.) M.-S. Kim, T. Ropitault, and N. Golmie are with the National Institute of Standards and Technology, Gaithersburg, MD 20899 USA.

Publisher Copyright:
© 2017 IEEE.

All Science Journal Classification (ASJC) codes

  • Modelling and Simulation
  • Computer Science Applications
  • Electrical and Electronic Engineering

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