Abstract
Smartphones' surface temperature, also called skin temperature, can rapidly heat up in certain cases, and this causes a variety of safety problems. Therefore, the thermal management of smartphones should consider the skin temperature, and its accurate prediction is important. However, due to the complicated relationship among the many exothermic components in the device, predicting skin temperature is extremely difficult. In this paper, we develop a thermal prediction model that accurately predicts the skin temperature of a mobile device. In an experiment with smartphones, we show that the proposed model achieves an accuracy of 98%, with a ±0.4 °C margin of error. To the best of our knowledge, our work is the first to reveal the complex relationship between the various components inside of a smartphone and its skin temperature.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 2018 Design, Automation and Test in Europe Conference and Exhibition, DATE 2018 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1500-1503 |
| Number of pages | 4 |
| Volume | 2018-January |
| ISBN (Electronic) | 9783981926316 |
| DOIs | |
| Publication status | Published - 2018 Apr 19 |
| Event | 2018 Design, Automation and Test in Europe Conference and Exhibition, DATE 2018 - Dresden, Germany Duration: 2018 Mar 19 → 2018 Mar 23 |
Other
| Other | 2018 Design, Automation and Test in Europe Conference and Exhibition, DATE 2018 |
|---|---|
| Country | Germany |
| City | Dresden |
| Period | 18/3/19 → 18/3/23 |
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All Science Journal Classification (ASJC) codes
- Safety, Risk, Reliability and Quality
- Hardware and Architecture
- Software
- Information Systems and Management
Cite this
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Accurate prediction of smartphones' skin temperature by considering exothermic components. / Park, Jihoon; Lee, Seokjun; Cha, Hojung.
Proceedings of the 2018 Design, Automation and Test in Europe Conference and Exhibition, DATE 2018. Vol. 2018-January Institute of Electrical and Electronics Engineers Inc., 2018. p. 1500-1503.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Accurate prediction of smartphones' skin temperature by considering exothermic components
AU - Park, Jihoon
AU - Lee, Seokjun
AU - Cha, Hojung
PY - 2018/4/19
Y1 - 2018/4/19
N2 - Smartphones' surface temperature, also called skin temperature, can rapidly heat up in certain cases, and this causes a variety of safety problems. Therefore, the thermal management of smartphones should consider the skin temperature, and its accurate prediction is important. However, due to the complicated relationship among the many exothermic components in the device, predicting skin temperature is extremely difficult. In this paper, we develop a thermal prediction model that accurately predicts the skin temperature of a mobile device. In an experiment with smartphones, we show that the proposed model achieves an accuracy of 98%, with a ±0.4 °C margin of error. To the best of our knowledge, our work is the first to reveal the complex relationship between the various components inside of a smartphone and its skin temperature.
AB - Smartphones' surface temperature, also called skin temperature, can rapidly heat up in certain cases, and this causes a variety of safety problems. Therefore, the thermal management of smartphones should consider the skin temperature, and its accurate prediction is important. However, due to the complicated relationship among the many exothermic components in the device, predicting skin temperature is extremely difficult. In this paper, we develop a thermal prediction model that accurately predicts the skin temperature of a mobile device. In an experiment with smartphones, we show that the proposed model achieves an accuracy of 98%, with a ±0.4 °C margin of error. To the best of our knowledge, our work is the first to reveal the complex relationship between the various components inside of a smartphone and its skin temperature.
UR - http://www.scopus.com/inward/record.url?scp=85048747265&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85048747265&partnerID=8YFLogxK
U2 - 10.23919/DATE.2018.8342251
DO - 10.23919/DATE.2018.8342251
M3 - Conference contribution
VL - 2018-January
SP - 1500
EP - 1503
BT - Proceedings of the 2018 Design, Automation and Test in Europe Conference and Exhibition, DATE 2018
PB - Institute of Electrical and Electronics Engineers Inc.
ER -