TY - GEN
T1 - Adhesion properties of copper/polyimide film modified by reactive ion etching(RIE)
AU - Lee, W. J.
AU - Kim, Yoon B.
AU - Lee, W. Y.
AU - Han, S. H.
AU - Han, J. H.
AU - Jee, K. K.
PY - 2007
Y1 - 2007
N2 - Surface modification of polyimide(PI) films was treated with oxygen RIE by varying ion doses from 1×1016 to 1×1018 ions/cm2at an ion beam energy of 250 eV, Following the modification of PI surface, metal films consisting of NiCr/Cu and Cu were deposited on modified PI films by D.C. magnetron sputtering and electroplating, respectively. The surface modified PI film was characterized by XPS, AFM, SEM and contact angle measurement, respectively. The water contact angle of PI film decreased significantly from 64° to 4.4° with an increase of ion dose, indicating that the surface energy of PI film increased. The XPS spectrum showed that functional group, particularly C-O bonding, on modified PI surface was significantly increased by interaction between scissored unstable chains and reactive ions. The modified PI film surfaces by oxygen RIE showed significant improvement in adhesion to a overcoated metal film of NiCr/Cu.
AB - Surface modification of polyimide(PI) films was treated with oxygen RIE by varying ion doses from 1×1016 to 1×1018 ions/cm2at an ion beam energy of 250 eV, Following the modification of PI surface, metal films consisting of NiCr/Cu and Cu were deposited on modified PI films by D.C. magnetron sputtering and electroplating, respectively. The surface modified PI film was characterized by XPS, AFM, SEM and contact angle measurement, respectively. The water contact angle of PI film decreased significantly from 64° to 4.4° with an increase of ion dose, indicating that the surface energy of PI film increased. The XPS spectrum showed that functional group, particularly C-O bonding, on modified PI surface was significantly increased by interaction between scissored unstable chains and reactive ions. The modified PI film surfaces by oxygen RIE showed significant improvement in adhesion to a overcoated metal film of NiCr/Cu.
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U2 - 10.4028/3-908451-31-0.1593
DO - 10.4028/3-908451-31-0.1593
M3 - Conference contribution
AN - SCOPUS:38549132582
SN - 3908451310
SN - 9783908451310
T3 - Solid State Phenomena
SP - 1593
EP - 1596
BT - Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia
PB - Trans Tech Publications Ltd
T2 - IUMRS International Conference in Asia 2006, IUMRS-ICA 2006
Y2 - 10 September 2006 through 14 September 2006
ER -