Adhesion properties of copper/polyimide film modified by reactive ion etching(RIE)

W. J. Lee, Yoon B. Kim, W. Y. Lee, S. H. Han, J. H. Han, K. K. Jee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Surface modification of polyimide(PI) films was treated with oxygen RIE by varying ion doses from 1×1016 to 1×1018 ions/cm2at an ion beam energy of 250 eV, Following the modification of PI surface, metal films consisting of NiCr/Cu and Cu were deposited on modified PI films by D.C. magnetron sputtering and electroplating, respectively. The surface modified PI film was characterized by XPS, AFM, SEM and contact angle measurement, respectively. The water contact angle of PI film decreased significantly from 64° to 4.4° with an increase of ion dose, indicating that the surface energy of PI film increased. The XPS spectrum showed that functional group, particularly C-O bonding, on modified PI surface was significantly increased by interaction between scissored unstable chains and reactive ions. The modified PI film surfaces by oxygen RIE showed significant improvement in adhesion to a overcoated metal film of NiCr/Cu.

Original languageEnglish
Title of host publicationAdvances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia
PublisherTrans Tech Publications Ltd
Pages1593-1596
Number of pages4
EditionPART 2
ISBN (Print)3908451310, 9783908451310
Publication statusPublished - 2007 Jan 1
EventIUMRS International Conference in Asia 2006, IUMRS-ICA 2006 - Jeju, Korea, Republic of
Duration: 2006 Sep 102006 Sep 14

Publication series

NameSolid State Phenomena
NumberPART 2
Volume124-126
ISSN (Print)1012-0394

Other

OtherIUMRS International Conference in Asia 2006, IUMRS-ICA 2006
CountryKorea, Republic of
CityJeju
Period06/9/1006/9/14

    Fingerprint

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Lee, W. J., Kim, Y. B., Lee, W. Y., Han, S. H., Han, J. H., & Jee, K. K. (2007). Adhesion properties of copper/polyimide film modified by reactive ion etching(RIE). In Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia (PART 2 ed., pp. 1593-1596). (Solid State Phenomena; Vol. 124-126, No. PART 2). Trans Tech Publications Ltd.