Advanced thick film system for AlN substrates

Y. L. Wang, A. F. Carroll, J. D. Smith, Yong Soo Cho, R. J. Bacher, D. K. Anderson, J. C. Crumpton, C. R.S. Needes

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Substrates with high thermal conductivity continue to be in great demand for their ability to enable smaller and denser high power circuits. BeO has been used for this purpose for many years with thick film materials. However, due to health and environmental concerns with BeO, many manufacturers feel compelled to switch to alternative substrates. This paper will discuss a thick film system consisting of conductors, dielectric, and resistors developed specifically for use with the most likely alternative, AlN substrates. This system will soon find broad use in applications such as power resistors for telecom, optoelectronic submounts, and high-power automotive applications.

Original languageEnglish
Pages (from-to)48-51
Number of pages4
JournalMicroelectronics International
Volume20
Issue number1
DOIs
Publication statusPublished - 2003 Jan 1

Fingerprint

Thick films
thick films
resistors
Resistors
Substrates
Optoelectronic devices
health
Thermal conductivity
thermal conductivity
switches
conductors
Switches
Health
Networks (circuits)

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

Wang, Y. L., Carroll, A. F., Smith, J. D., Cho, Y. S., Bacher, R. J., Anderson, D. K., ... Needes, C. R. S. (2003). Advanced thick film system for AlN substrates. Microelectronics International, 20(1), 48-51. https://doi.org/10.1108/13565360310455535
Wang, Y. L. ; Carroll, A. F. ; Smith, J. D. ; Cho, Yong Soo ; Bacher, R. J. ; Anderson, D. K. ; Crumpton, J. C. ; Needes, C. R.S. / Advanced thick film system for AlN substrates. In: Microelectronics International. 2003 ; Vol. 20, No. 1. pp. 48-51.
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Wang, YL, Carroll, AF, Smith, JD, Cho, YS, Bacher, RJ, Anderson, DK, Crumpton, JC & Needes, CRS 2003, 'Advanced thick film system for AlN substrates', Microelectronics International, vol. 20, no. 1, pp. 48-51. https://doi.org/10.1108/13565360310455535

Advanced thick film system for AlN substrates. / Wang, Y. L.; Carroll, A. F.; Smith, J. D.; Cho, Yong Soo; Bacher, R. J.; Anderson, D. K.; Crumpton, J. C.; Needes, C. R.S.

In: Microelectronics International, Vol. 20, No. 1, 01.01.2003, p. 48-51.

Research output: Contribution to journalArticle

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Wang YL, Carroll AF, Smith JD, Cho YS, Bacher RJ, Anderson DK et al. Advanced thick film system for AlN substrates. Microelectronics International. 2003 Jan 1;20(1):48-51. https://doi.org/10.1108/13565360310455535