AFM probe tips using heavily boron-doped silicon cantilevers realized in a <110> bulk silicon wafer

Il Joo Cho, Eun Chul Park, Euisik Yoon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

In this paper, we report a new method of fabricating AFM (Atomic Force Microscope) probe tips at low cost. Most of previous AFM probe tips have been made of SOI wafers using back-side anisotropic silicon etch [1]. Therefore, the wafer cost is high and the dimension control is poor because the tip length and thickness depend on wafer thickness variation and etch non-uniformity during the tip formation, respectively. In this paper we propose a new fabrication process in which probe tips are formed self-aligned to the p+ (heavily boron-doped) cantilevers from the front-side etch of a <110> bulk silicon wafer.

Original languageEnglish
Title of host publicationDigest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages230-231
Number of pages2
ISBN (Electronic)4891140046, 9784891140045
DOIs
Publication statusPublished - 2000 Jan 1
EventInternational Microprocesses and Nanotechnology Conference, MNC 2000 - Tokyo, Japan
Duration: 2000 Jul 112000 Jul 13

Publication series

NameDigest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000

Other

OtherInternational Microprocesses and Nanotechnology Conference, MNC 2000
CountryJapan
CityTokyo
Period00/7/1100/7/13

All Science Journal Classification (ASJC) codes

  • Biotechnology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Cho, I. J., Park, E. C., & Yoon, E. (2000). AFM probe tips using heavily boron-doped silicon cantilevers realized in a <110> bulk silicon wafer. In Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000 (pp. 230-231). [872729] (Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMNC.2000.872729