Air-stable, surface-oxide free Cu nanoparticles are, for the first time, synthesized by surrounding completely the Cu surface with oleic acid incorporated as a capping molecule. XPS analysis, in conjunction with TEM analysis, revealed that the oleic acid is chemisorbed to the Cu surface via a chemical interaction wherein a monodentate bond is included, without leaving behind free (non-interacting) oleic acid, thereby providing complete surface protection against oxidation. By eliminating the surface oxide layer that critically degrades the electrical properties, the surface-oxide free Cu nanoparticle ink facilitates the realization of a solution-processed Cu electrode layer with resistivity as low as 4 μΩ cm, comparable to the resistivity of noble metal-based, solution-processed counterparts. In addition, high resolution Cu electrode patterns with 5 μm line-width are directly printed using an electrohydrodynamic inkjet technique, and graphene transistors with the printed Cu electrodes demonstrate potential applications in printed electronics.
All Science Journal Classification (ASJC) codes
- Materials Chemistry