Abstract
2D van der Waals (vdW) materials have been considered as potential building blocks for use in fundamental elements of electronic and optoelectronic devices, such as electrodes, channels, and dielectrics, because of their diverse and remarkable electrical properties. Furthermore, two or more building blocks of different electronic types can be stacked vertically to generate vdW heterostructures with desired electrical behaviors. However, such fundamental approaches cannot directly be applied practically because of issues such as precise alignment/positioning and large-quantity material production. Here, these limitations are overcome and wafer-scale vdW heterostructures are demonstrated by exploiting the lateral and vertical assembly of solution-processed 2D vdW materials. The high exfoliation yield of the molecular intercalation-assisted approach enables the production of micrometer-sized nanosheets in large quantities and its lateral assembly in a wafer-scale via vdW interactions. Subsequently, the laterally assembled vdW thin-films are vertically assembled to demonstrate various electronic device applications, such as transistors and photodetectors. Furthermore, multidimensional vdW heterostructures are demonstrated by integrating 1D carbon nanotubes as a p-type semiconductor to fabricate p–n diodes and complementary logic gates. Finally, electronic devices are fabricated via inkjet printing as a lithography-free manner based on the stable nanomaterial dispersions.
Original language | English |
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Article number | 2106110 |
Journal | Advanced Materials |
Volume | 34 |
Issue number | 12 |
DOIs | |
Publication status | Published - 2022 Mar 24 |
Bibliographical note
Funding Information:J.K., D.R., and O.S. contributed equally to this work. This study was supported by a National Research Foundation of Korea (NRF) grant funded by the Korean Government (MSIT) (Nos. 2020R1C1C1009381, 2019M3D1A2104108, and 2020R1A4A2002806), and the Korea Basic Science Institute (KBSI) National Research Facilities and Equipment Center (NFEC) grant funded by the Korean Government (Ministry of Education) (No. 2019R1A6C1010031). V.M., L.V., and Z.S. acknowledge their support from Project No. LTAUSA19034 of the Ministry of Education Youth and Sports (MEYS) and the Czech Science Foundation (GACR No. 20-16124J), and the grant of Specific University Research (Grant No. A2_FCHT_2021_006).
Publisher Copyright:
© 2022 Wiley-VCH GmbH.
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Mechanics of Materials
- Mechanical Engineering