An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip

Min Gu Kim, Yong Ho Kim, Chul Woo Park, Jungho Hwang, Yong-Jun Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports an electrodynamic anti-adhesion technique to detach particles adhered to the wall of microchannels. Electrodynamic disturbance is generated by applying electric potential at the frequency of 100 Hz to the interdigitated electrodes integrated at the bottom of the microchannel. Polystyrene latexes, ranging in diameter from 0.5 to 1.1 μm, were supplied to the microchannel. Before applying electric potential, particles adhered to the wall about 80% and only 20% of the supplied particles arrived at the outlet. By applying electric potential 1 to 3 kV, outlet concentrations was increased and particle loss was decreased by 36% at 1.1 μm.

Original languageEnglish
Title of host publicationTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages405-408
Number of pages4
DOIs
Publication statusPublished - 2009 Dec 11
EventTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States
Duration: 2009 Jun 212009 Jun 25

Other

OtherTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
CountryUnited States
CityDenver, CO
Period09/6/2109/6/25

Fingerprint

Electrodynamics
Microchannels
Aerodynamics
Adhesion
Electric potential
Latexes
Polystyrenes
Electrodes

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Kim, M. G., Kim, Y. H., Park, C. W., Hwang, J., & Kim, Y-J. (2009). An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip. In TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 405-408). [5285476] https://doi.org/10.1109/SENSOR.2009.5285476
Kim, Min Gu ; Kim, Yong Ho ; Park, Chul Woo ; Hwang, Jungho ; Kim, Yong-Jun. / An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip. TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. pp. 405-408
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title = "An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip",
abstract = "This paper reports an electrodynamic anti-adhesion technique to detach particles adhered to the wall of microchannels. Electrodynamic disturbance is generated by applying electric potential at the frequency of 100 Hz to the interdigitated electrodes integrated at the bottom of the microchannel. Polystyrene latexes, ranging in diameter from 0.5 to 1.1 μm, were supplied to the microchannel. Before applying electric potential, particles adhered to the wall about 80{\%} and only 20{\%} of the supplied particles arrived at the outlet. By applying electric potential 1 to 3 kV, outlet concentrations was increased and particle loss was decreased by 36{\%} at 1.1 μm.",
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Kim, MG, Kim, YH, Park, CW, Hwang, J & Kim, Y-J 2009, An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip. in TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems., 5285476, pp. 405-408, TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems, Denver, CO, United States, 09/6/21. https://doi.org/10.1109/SENSOR.2009.5285476

An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip. / Kim, Min Gu; Kim, Yong Ho; Park, Chul Woo; Hwang, Jungho; Kim, Yong-Jun.

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 405-408 5285476.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Kim MG, Kim YH, Park CW, Hwang J, Kim Y-J. An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip. In TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 405-408. 5285476 https://doi.org/10.1109/SENSOR.2009.5285476