An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip

Min Gu Kim; Yong Ho Kim; Chul Woo Park; Jungho Hwang; Yong Jun Kim

doi:10.1109/SENSOR.2009.5285476

An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip

Min Gu Kim, Yong Ho Kim, Chul Woo Park, Jungho Hwang, Yong Jun Kim

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper reports an electrodynamic anti-adhesion technique to detach particles adhered to the wall of microchannels. Electrodynamic disturbance is generated by applying electric potential at the frequency of 100 Hz to the interdigitated electrodes integrated at the bottom of the microchannel. Polystyrene latexes, ranging in diameter from 0.5 to 1.1 μm, were supplied to the microchannel. Before applying electric potential, particles adhered to the wall about 80% and only 20% of the supplied particles arrived at the outlet. By applying electric potential 1 to 3 kV, outlet concentrations was increased and particle loss was decreased by 36% at 1.1 μm.

Original language	English
Title of host publication	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages	405-408
Number of pages	4
DOIs	https://doi.org/10.1109/SENSOR.2009.5285476
Publication status	Published - 2009
Event	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States Duration: 2009 Jun 21 → 2009 Jun 25

Publication series

Name	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Other

Other	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Country/Territory	United States
City	Denver, CO
Period	09/6/21 → 09/6/25

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

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10.1109/SENSOR.2009.5285476

Cite this

Kim, M. G., Kim, Y. H., Park, C. W., Hwang, J., & Kim, Y. J. (2009). An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip. In TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 405-408). [5285476] (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems). https://doi.org/10.1109/SENSOR.2009.5285476

Kim, Min Gu ; Kim, Yong Ho ; Park, Chul Woo et al. / An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip. TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. pp. 405-408 (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems).

@inproceedings{6101685d30f241da8636a9eeeaec81ee,

title = "An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip",

abstract = "This paper reports an electrodynamic anti-adhesion technique to detach particles adhered to the wall of microchannels. Electrodynamic disturbance is generated by applying electric potential at the frequency of 100 Hz to the interdigitated electrodes integrated at the bottom of the microchannel. Polystyrene latexes, ranging in diameter from 0.5 to 1.1 μm, were supplied to the microchannel. Before applying electric potential, particles adhered to the wall about 80% and only 20% of the supplied particles arrived at the outlet. By applying electric potential 1 to 3 kV, outlet concentrations was increased and particle loss was decreased by 36% at 1.1 μm.",

author = "Kim, {Min Gu} and Kim, {Yong Ho} and Park, {Chul Woo} and Jungho Hwang and Kim, {Yong Jun}",

year = "2009",

doi = "10.1109/SENSOR.2009.5285476",

language = "English",

isbn = "9781424441938",

series = "TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems",

pages = "405--408",

booktitle = "TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems",

note = "TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems ; Conference date: 21-06-2009 Through 25-06-2009",

}

Kim, MG, Kim, YH, Park, CW, Hwang, J & Kim, YJ 2009, An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip. in TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems., 5285476, TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 405-408, TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems, Denver, CO, United States, 09/6/21. https://doi.org/10.1109/SENSOR.2009.5285476

An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip. / Kim, Min Gu; Kim, Yong Ho; Park, Chul Woo et al.

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 405-408 5285476 (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - This paper reports an electrodynamic anti-adhesion technique to detach particles adhered to the wall of microchannels. Electrodynamic disturbance is generated by applying electric potential at the frequency of 100 Hz to the interdigitated electrodes integrated at the bottom of the microchannel. Polystyrene latexes, ranging in diameter from 0.5 to 1.1 μm, were supplied to the microchannel. Before applying electric potential, particles adhered to the wall about 80% and only 20% of the supplied particles arrived at the outlet. By applying electric potential 1 to 3 kV, outlet concentrations was increased and particle loss was decreased by 36% at 1.1 μm.

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Kim MG, Kim YH, Park CW, Hwang J , Kim YJ. An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip. In TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 405-408. 5285476. (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems). doi: 10.1109/SENSOR.2009.5285476

An anti-adhesion technique reducing particle-loss using electrodynamic distrurbance for aerodynamic chip

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