An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA

Seung Ho Shin; Hayoung Lee; Younwoo Yoo; Sungho Kang

doi:10.1109/ISOCC53507.2021.9613980

An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA

Seung Ho Shin, Hayoung Lee, Younwoo Yoo, Sungho Kang

Department of Electrical and Electronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Three-dimensional (3D) memory is widely developed to fulfill the ever-increasing memory densities. For the high reliability of 3D memory, the traditional spare structures that consist of simple rows and columns have a difficulty to maximize the efficiency of spare allocation. Therefore, various spare structures are adopted to achieve a high repair rate improvement for multiple banks memory. However, the previous studies have not proposed any methodology to allocate various spare structures with BIRA. For this reason, a new effective spare allocation methodology for the pre-bond and the post-bond repair is proposed. Also, the methodology can be verified by six representative various spare structures with the sequential allocation BIRA.

Original language	English
Title of host publication	Proceedings - International SoC Design Conference 2021, ISOCC 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	429-430
Number of pages	2
ISBN (Electronic)	9781665401746
DOIs	https://doi.org/10.1109/ISOCC53507.2021.9613980
Publication status	Published - 2021
Event	18th International System-on-Chip Design Conference, ISOCC 2021 - Jeju Island, Korea, Republic of Duration: 2021 Oct 6 → 2021 Oct 9

Publication series

Name	Proceedings - International SoC Design Conference 2021, ISOCC 2021

Conference

Conference	18th International System-on-Chip Design Conference, ISOCC 2021
Country/Territory	Korea, Republic of
City	Jeju Island
Period	21/10/6 → 21/10/9

Bibliographical note

Funding Information:
This work was supported by the National Research Foundation of Korea(NRF) grant funded by the Korea(MSIT) (No. 2019R1A2C3011079).

Publisher Copyright:
© 2021 IEEE.

All Science Journal Classification (ASJC) codes

Computer Networks and Communications
Information Systems
Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/ISOCC53507.2021.9613980

Cite this

Shin, S. H., Lee, H., Yoo, Y., & Kang, S. (2021). An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA. In Proceedings - International SoC Design Conference 2021, ISOCC 2021 (pp. 429-430). (Proceedings - International SoC Design Conference 2021, ISOCC 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC53507.2021.9613980

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title = "An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA",

abstract = "Three-dimensional (3D) memory is widely developed to fulfill the ever-increasing memory densities. For the high reliability of 3D memory, the traditional spare structures that consist of simple rows and columns have a difficulty to maximize the efficiency of spare allocation. Therefore, various spare structures are adopted to achieve a high repair rate improvement for multiple banks memory. However, the previous studies have not proposed any methodology to allocate various spare structures with BIRA. For this reason, a new effective spare allocation methodology for the pre-bond and the post-bond repair is proposed. Also, the methodology can be verified by six representative various spare structures with the sequential allocation BIRA.",

author = "Shin, {Seung Ho} and Hayoung Lee and Younwoo Yoo and Sungho Kang",

note = "Funding Information: This work was supported by the National Research Foundation of Korea(NRF) grant funded by the Korea(MSIT) (No. 2019R1A2C3011079). Publisher Copyright: {\textcopyright} 2021 IEEE.; 18th International System-on-Chip Design Conference, ISOCC 2021 ; Conference date: 06-10-2021 Through 09-10-2021",

year = "2021",

doi = "10.1109/ISOCC53507.2021.9613980",

language = "English",

series = "Proceedings - International SoC Design Conference 2021, ISOCC 2021",

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Shin, SH, Lee, H, Yoo, Y & Kang, S 2021, An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA. in Proceedings - International SoC Design Conference 2021, ISOCC 2021. Proceedings - International SoC Design Conference 2021, ISOCC 2021, Institute of Electrical and Electronics Engineers Inc., pp. 429-430, 18th International System-on-Chip Design Conference, ISOCC 2021, Jeju Island, Korea, Republic of, 21/10/6. https://doi.org/10.1109/ISOCC53507.2021.9613980

An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA. / Shin, Seung Ho; Lee, Hayoung; Yoo, Younwoo et al.

Proceedings - International SoC Design Conference 2021, ISOCC 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 429-430 (Proceedings - International SoC Design Conference 2021, ISOCC 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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N2 - Three-dimensional (3D) memory is widely developed to fulfill the ever-increasing memory densities. For the high reliability of 3D memory, the traditional spare structures that consist of simple rows and columns have a difficulty to maximize the efficiency of spare allocation. Therefore, various spare structures are adopted to achieve a high repair rate improvement for multiple banks memory. However, the previous studies have not proposed any methodology to allocate various spare structures with BIRA. For this reason, a new effective spare allocation methodology for the pre-bond and the post-bond repair is proposed. Also, the methodology can be verified by six representative various spare structures with the sequential allocation BIRA.

AB - Three-dimensional (3D) memory is widely developed to fulfill the ever-increasing memory densities. For the high reliability of 3D memory, the traditional spare structures that consist of simple rows and columns have a difficulty to maximize the efficiency of spare allocation. Therefore, various spare structures are adopted to achieve a high repair rate improvement for multiple banks memory. However, the previous studies have not proposed any methodology to allocate various spare structures with BIRA. For this reason, a new effective spare allocation methodology for the pre-bond and the post-bond repair is proposed. Also, the methodology can be verified by six representative various spare structures with the sequential allocation BIRA.

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An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA

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