An efficient self post package repair algorithm and implementation in memory system with on-chip-ECC

Yun Sang Lee, Jung Bae Lee, Chang Hyun Kim, Sang Uhn Cha, Hongil Yoon

Research output: Contribution to conferencePaper

Abstract

An efficient self post package repair algorithm using on-chip-ECC is proposed and the circuit implementation details are presented. The proposed algorithm identifies and stores the addresses of hard fault detected by on-chip-ECC during post package test phase and performs subsequent repairs with changing supply voltage level controlled by tester. A yield improvement by 1∼1.5% is expected and the efficiency of test and repair steps is enhanced by about 58∼67%. The chip size overhead for its implementation is estimated to be under 0.4% for an 80nm 1Gb memory.

Original languageEnglish
Pages331-334
Number of pages4
DOIs
Publication statusPublished - 2006 Dec 1
Event2006 IEEE Asian Solid-State Circuits Conference, ASSCC 2006 - Hangzhou, China
Duration: 2006 Nov 132006 Nov 15

Other

Other2006 IEEE Asian Solid-State Circuits Conference, ASSCC 2006
CountryChina
CityHangzhou
Period06/11/1306/11/15

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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    Lee, Y. S., Lee, J. B., Kim, C. H., Cha, S. U., & Yoon, H. (2006). An efficient self post package repair algorithm and implementation in memory system with on-chip-ECC. 331-334. Paper presented at 2006 IEEE Asian Solid-State Circuits Conference, ASSCC 2006, Hangzhou, China. https://doi.org/10.1109/ASSCC.2006.357918