An EPC Gen 2 compatible passive/semi-active UHF RFID transponder with embedded FeRAM and temperature sensor

Shiho Kim, Jung Hyun Cho, Hyun Sik Kim, Haksoo Kim, Hee Bok Kang, Suk Kyung Hong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

38 Citations (Scopus)

Abstract

A fully integrated passive and battery powered semi-active UHF RFID transponder chip supporting EPC Gen 2 protocol is presented. The proposed transponder works as a passive RFID tag when the generated RF-power is sufficient to operate, otherwise it operates in semi-active mode using battery power. The chip has re-writeable non-volatile memory bank formed by FeRAM and on-chip temperature sensor. The memory consists of EPC memory bank for EPC functionality and temperature bank for storing sensed data. The standby current in semi-active is about 0.5uA, the lifetime in semi-active mode is in excess of 2 year with a 10mA-hr thin film battery.

Original languageEnglish
Title of host publication2007 IEEE Asian Solid-State Circuits Conference, A-SSCC
Pages135-138
Number of pages4
DOIs
Publication statusPublished - 2007 Dec 1
Event2007 IEEE Asian Solid-State Circuits Conference, A-SSCC - Jeju, Korea, Republic of
Duration: 2007 Nov 122007 Nov 14

Publication series

Name2007 IEEE Asian Solid-State Circuits Conference, A-SSCC

Other

Other2007 IEEE Asian Solid-State Circuits Conference, A-SSCC
CountryKorea, Republic of
CityJeju
Period07/11/1207/11/14

Fingerprint

Transponders
Temperature sensors
Radio frequency identification (RFID)
Data storage equipment
Thin films
Temperature

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Kim, S., Cho, J. H., Kim, H. S., Kim, H., Kang, H. B., & Hong, S. K. (2007). An EPC Gen 2 compatible passive/semi-active UHF RFID transponder with embedded FeRAM and temperature sensor. In 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC (pp. 135-138). [4425750] (2007 IEEE Asian Solid-State Circuits Conference, A-SSCC). https://doi.org/10.1109/ASSCC.2007.4425750
Kim, Shiho ; Cho, Jung Hyun ; Kim, Hyun Sik ; Kim, Haksoo ; Kang, Hee Bok ; Hong, Suk Kyung. / An EPC Gen 2 compatible passive/semi-active UHF RFID transponder with embedded FeRAM and temperature sensor. 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC. 2007. pp. 135-138 (2007 IEEE Asian Solid-State Circuits Conference, A-SSCC).
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abstract = "A fully integrated passive and battery powered semi-active UHF RFID transponder chip supporting EPC Gen 2 protocol is presented. The proposed transponder works as a passive RFID tag when the generated RF-power is sufficient to operate, otherwise it operates in semi-active mode using battery power. The chip has re-writeable non-volatile memory bank formed by FeRAM and on-chip temperature sensor. The memory consists of EPC memory bank for EPC functionality and temperature bank for storing sensed data. The standby current in semi-active is about 0.5uA, the lifetime in semi-active mode is in excess of 2 year with a 10mA-hr thin film battery.",
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Kim, S, Cho, JH, Kim, HS, Kim, H, Kang, HB & Hong, SK 2007, An EPC Gen 2 compatible passive/semi-active UHF RFID transponder with embedded FeRAM and temperature sensor. in 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC., 4425750, 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC, pp. 135-138, 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC, Jeju, Korea, Republic of, 07/11/12. https://doi.org/10.1109/ASSCC.2007.4425750

An EPC Gen 2 compatible passive/semi-active UHF RFID transponder with embedded FeRAM and temperature sensor. / Kim, Shiho; Cho, Jung Hyun; Kim, Hyun Sik; Kim, Haksoo; Kang, Hee Bok; Hong, Suk Kyung.

2007 IEEE Asian Solid-State Circuits Conference, A-SSCC. 2007. p. 135-138 4425750 (2007 IEEE Asian Solid-State Circuits Conference, A-SSCC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Kim S, Cho JH, Kim HS, Kim H, Kang HB, Hong SK. An EPC Gen 2 compatible passive/semi-active UHF RFID transponder with embedded FeRAM and temperature sensor. In 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC. 2007. p. 135-138. 4425750. (2007 IEEE Asian Solid-State Circuits Conference, A-SSCC). https://doi.org/10.1109/ASSCC.2007.4425750