An experimental study on the package stress in plastic encapsulated IC (integrated circuit)

Minju Lee, Won Gu Joo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Transfer molding is the primary process for IC (integrated circuit) encapsulation with EMC (epoxy molding compound) and also the most extensive method for plastic packaging. Plastic encapsulated packages offer many advantages over their other counterparts such as low cost, light weight, and ready availability that accounted for approximately 98% of IC packages produced within the microelectronics industry. The recent trends in plastic packaging are packages becoming thinner and smaller where drawbacks are more serious in terms of package stress from the transfer molding process. It is for this reason that the need for thorough understanding of package stress is becoming greater. In this paper, flow-induced package stress is experimentally visualized to analyze time-dependence flow characteristics of EMC by employing different geometrical gate design parameters. Also, EMCs with different material properties are evaluated to quantify their influence on package stress in terms of interfacial adhesion, warpage, voiding, wire sweep, and penetration rate. In addition, screening DOE (design of experiments) is performed to identify the main process parameters, and the optimum window of critical parameters is defined by RSM (response surface methodology).

Original languageEnglish
Title of host publicationAdvances in Electronic Materials and Packaging 2001
EditorsS.B. Lee, K.W. Paik
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages268-273
Number of pages6
ISBN (Electronic)0780371577, 9780780371576
DOIs
Publication statusPublished - 2001 Jan 1
Event3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 - Jeju Island, Korea, Republic of
Duration: 2001 Nov 192001 Nov 22

Publication series

NameAdvances in Electronic Materials and Packaging 2001

Other

Other3rd International Symposium on Electronic Materials and Packaging, EMAP 2001
CountryKorea, Republic of
CityJeju Island
Period01/11/1901/11/22

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Lee, M., & Joo, W. G. (2001). An experimental study on the package stress in plastic encapsulated IC (integrated circuit). In S. B. Lee, & K. W. Paik (Eds.), Advances in Electronic Materials and Packaging 2001 (pp. 268-273). [983996] (Advances in Electronic Materials and Packaging 2001). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2001.983996