An overview of LTCC-related technologies in Korea

Yong Soo Cho, Won Bae Lim, Jun Chul Kim, Nam Kee Kang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

There is no doubt that LTCC (Low temperature Co-fired Ceramics)-related technologies provide current and future solutions of highly dense and reliable packages for various advancing applications. These applications are asSociated mainly with the so-called digital industries that require novel materials and package designs for the products of microelectronic components, displays, imaging, fuel cells, batteries, etc. Korea, one of the strongest countries in IT-related technology and products, has been an eager user of the LTCC-related technologies to make such applications realized. This short overview deals with current LTCC-related technologies and R&D activities in Korea, with f°Cus on materials technology and applications that have been reported for the last few years.

Original languageEnglish
Title of host publicationIMAPS/ACerS - 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006
Pages449-451
Number of pages3
Publication statusPublished - 2006 Dec 1
Event2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006 - Denver, CO, United States
Duration: 2006 Apr 242006 Apr 27

Publication series

NameIMAPS/ACerS - 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006

Other

Other2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006
CountryUnited States
CityDenver, CO
Period06/4/2406/4/27

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All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Ceramics and Composites

Cite this

Cho, Y. S., Lim, W. B., Kim, J. C., & Kang, N. K. (2006). An overview of LTCC-related technologies in Korea. In IMAPS/ACerS - 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006 (pp. 449-451). (IMAPS/ACerS - 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006).