TY - GEN
T1 - An overview of LTCC-related technologies in Korea
AU - Cho, Yong Soo
AU - Lim, Won Bae
AU - Kim, Jun Chul
AU - Kang, Nam Kee
PY - 2006
Y1 - 2006
N2 - There is no doubt that LTCC (Low temperature Co-fired Ceramics)-related technologies provide current and future solutions of highly dense and reliable packages for various advancing applications. These applications are asSociated mainly with the so-called digital industries that require novel materials and package designs for the products of microelectronic components, displays, imaging, fuel cells, batteries, etc. Korea, one of the strongest countries in IT-related technology and products, has been an eager user of the LTCC-related technologies to make such applications realized. This short overview deals with current LTCC-related technologies and R&D activities in Korea, with f°Cus on materials technology and applications that have been reported for the last few years.
AB - There is no doubt that LTCC (Low temperature Co-fired Ceramics)-related technologies provide current and future solutions of highly dense and reliable packages for various advancing applications. These applications are asSociated mainly with the so-called digital industries that require novel materials and package designs for the products of microelectronic components, displays, imaging, fuel cells, batteries, etc. Korea, one of the strongest countries in IT-related technology and products, has been an eager user of the LTCC-related technologies to make such applications realized. This short overview deals with current LTCC-related technologies and R&D activities in Korea, with f°Cus on materials technology and applications that have been reported for the last few years.
UR - http://www.scopus.com/inward/record.url?scp=84878254130&partnerID=8YFLogxK
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M3 - Conference contribution
AN - SCOPUS:84878254130
SN - 9781604236200
T3 - IMAPS/ACerS - 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006
SP - 449
EP - 451
BT - IMAPS/ACerS - 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006
T2 - 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006
Y2 - 24 April 2006 through 27 April 2006
ER -