This paper deals with an analysis on the optimum lap joint method of the YBCO coated conductor (CC) wire. Effective low resistance joint is important for the development of persistent current mode system using the second generation high temperature superconducting (2G HTS) wire, YBCO CC. CC tape is stacked with copper or stainless steel stabilizer, silver layer, YBCO layer, buffer and substrate. The joint between CCs was performed with low temperature InBi solder. YBCO samples with various contact conditions were fabricated and tested. Characteristics of jointed CC tape were evaluated from the V-I curve and contact resistance was derived from experimental results. Characteristics of jointed CC were investigated by electrical analysis and optical micrograph. The BSCCO wires were jointed at different conditions, and the results were compared with the joint between the YBCO CCs.
Bibliographical noteFunding Information:
Manuscript received August 29, 2006. This work was supported by KESRI(R-2005-7-090), which is funded by MOCIE (Ministry of Commerce, Industry and Energy). D. K. Park, K. S. Chang, S. E. Yang, and T. K. Ko are with the School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea (e-mail: firstname.lastname@example.org). M. C. Ahn is with the Korea Electrical Engineering & Science Research Institute, Seoul, Korea (e-mail: email@example.com). H. M. Kim is with the Korea Electrotechnology Research Institute, Changwon, Korea (e-mail: firstname.lastname@example.org). H. G. Lee is with the Department of Material Science and Engineering, Korea University, Seoul, Korea (e-mail: email@example.com). S. J. Lee is with the Department of Electrical Engineering, Uiduk University, Kyoungju, Korea (e-mail: firstname.lastname@example.org). Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TASC.2007.899590
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering