Analysis of coupling effects to PCBs with adjacent compartments inside waveguide using the mBLT equation

Jin Kyoung Du, Se Young Hyun, Jongwon Lee, Jin Soo Choi, Jong Gwan Yook

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, coupling effects to PCBs are investigated with three cases of adjacent compartments inside a missile, which is simplified to a rectangular waveguide structure. When calculating the coupling effects to a target PCB inside waveguides, it is found that the configurations of electric systems inside the adjacent compartment can be ignored. Whereas the coupling effects are dominantly influenced from the parallel-plate resonance characteristics of a target PCB itself, as well as a metal frame structure of the waveguide including apertures. The calculated results are achieved using the mBLT equation and compared with full-wave analysis results, showing good agreements.

Original languageEnglish
Title of host publication2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1387-1389
Number of pages3
ISBN (Electronic)9784902339314
Publication statusPublished - 2014 Mar 25
Event2014 Asia-Pacific Microwave Conference, APMC 2014 - Sendai, Japan
Duration: 2014 Nov 42014 Nov 7

Publication series

Name2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014

Other

Other2014 Asia-Pacific Microwave Conference, APMC 2014
CountryJapan
CitySendai
Period14/11/414/11/7

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All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Du, J. K., Hyun, S. Y., Lee, J., Choi, J. S., & Yook, J. G. (2014). Analysis of coupling effects to PCBs with adjacent compartments inside waveguide using the mBLT equation. In 2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014 (pp. 1387-1389). [7067726] (2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014). Institute of Electrical and Electronics Engineers Inc..