Analysis of signal integrity/power integrity in multilayer printed circuit board and two improving methods

Hee Do Kang, Hyun Kim, Jong Gwan Yook

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The signal integrity (SI) and power integrity (PI) in multilayer printed circuit board is analyzed using three-dimensional (3D) full EM simulation and the circuit simulation. As a result of that, the dominant factor of SI/PI on the test board is noise coupling by GND via. Hence, two methods are applied to suppress the coupling; differential signaling and anti-via structure. Using these two methods, the noise on the signal line and power via can be suppressed, remarkably. Therefore, the SI/PI in multilayer PCB can be guaranteed to the low noise level.

Original languageEnglish
Title of host publication2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
Pages210-213
Number of pages4
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Seoul, Korea, Republic of
Duration: 2008 Dec 102008 Dec 12

Other

Other2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
CountryKorea, Republic of
CitySeoul
Period08/12/1008/12/12

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All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Kang, H. D., Kim, H., & Yook, J. G. (2008). Analysis of signal integrity/power integrity in multilayer printed circuit board and two improving methods. In 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings (pp. 210-213). [4736037] https://doi.org/10.1109/EDAPS.2008.4736037