Owing to their superior electrical performance, multilayer ceramic capacitors (MLCCs) are widely applied in a variety of electronic devices. The acoustic noise of MLCCs is an important factor to be considered when selecting MLCCs for specific applications, such as smart phones. This noise is directly related to the vibration of the printed circuit board (PCB) on which MLCCs are mounted. Therefore, to improve the noise and vibration characteristics, this paper investigated the effects of soldering parameters on PCB vibration. Based on the findings, a novel soldering method that reduces vibration is described.
Bibliographical noteFunding Information:
This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korean government (2013R1A2A1A01016979).
© 2015, Springer-Verlag Berlin Heidelberg.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Hardware and Architecture
- Electrical and Electronic Engineering