Analysis of the influence of soldering parameters on multi-layer ceramic capacitor vibration

Yi Qi Wang, Byung Han Ko, Sang Geuk Jeong, Kyoung Su Park, No Cheol Park, Young Pil Park

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Owing to their superior electrical performance, multilayer ceramic capacitors (MLCCs) are widely applied in a variety of electronic devices. The acoustic noise of MLCCs is an important factor to be considered when selecting MLCCs for specific applications, such as smart phones. This noise is directly related to the vibration of the printed circuit board (PCB) on which MLCCs are mounted. Therefore, to improve the noise and vibration characteristics, this paper investigated the effects of soldering parameters on PCB vibration. Based on the findings, a novel soldering method that reduces vibration is described.

Original languageEnglish
Pages (from-to)2565-2571
Number of pages7
JournalMicrosystem Technologies
Volume21
Issue number12
DOIs
Publication statusPublished - 2015 Mar 27

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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