Currently, almost all hard disk drives (HDDs) have adopted a loading/unloading mechanism that increases their recording capacity and improves their reliability. However, these mechanisms still create a few scratches or defects in the loading/unloading zone. Slipping at the dimple-flexure interface was recently reported as one of the causes. In this research, we first analyzed the relative behavior of dimple-flexure based on fretting wear marks. We determined that the dimple-flexure behavior included both slipping and rotating motion simultaneously. We then verified the distinct slipping and rolling phenomenon at the moment of ramp contact using finite-element method (FEM) analysis. An experimental setup was constructed, and an unloading experiment was carried out to obtain the ramp contact characteristics corresponding to various unloading velocities. Based on the verified FEM, the characteristics of dimple-flexure relative behavior were investigated for various suspension design parameters, ramp contact characteristics, and unloading velocities. A higher ramp contact force and shorter contact duration resulted in larger slip displacements and roll angles between the dimple and the flexure. Finally, we analyzed the unloading performance of an HDD for various design parameters using quasi-static approximation while considering the relative behavior between the dimple and flexure. The quasi-static analysis indicated a change of approximately 15 % in the flying height at an unloading velocity of 40 in. per second when the relative motion between the dimple and flexure was considered during the unloading process. Even, slider-disk contact occurred at an unloading velocity of 50 ISP.
Bibliographical noteFunding Information:
This work was supported by the National Research Foundation of Korea (NRF) Grant funded by the Korea government (MEST) (No. 2011-8-0167).
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Hardware and Architecture
- Electrical and Electronic Engineering