Angle resolved X-ray photoelectron spectroscopic analysis on the surface of wet-etched copper

Min Gu Kang, Moon Ho Jo, Hyung Ho Park, Chan Ho Kim

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Abstract

Thermally evaporated copper was chemically etched with 3.5M CuCl2 + 0.5M HCl + 0.5M KCl solution at room temperature. X-ray photoelectron spectroscopy (XPS) was used to characterize the surface chemical bonding states. The result shows that chemically etched copper surface is composed of carbon, oxygen, chlorine, and copper. The bonding state of the surface has been known to be indistinguishable due to their small chemical shift in the photoelectron spectra. However, using the nondestructive angle resolved XPS technique the distribution of bonding states was revealed. They could be completely distinguished through the qualitative and quantitative comparison of related bonding states in the observed elements. After air exposure of wet etched Cu for 2 days, the bonding state of the surface was also analyzed quantitatively through photoelectron and Auger electron spectroscopic works.

Original languageEnglish
Pages (from-to)3869-3875
Number of pages7
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume35
Issue number7
Publication statusPublished - 1996 Jul 1

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All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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