We have designed, fabricated and tested self-aligned angular vertical comb-drive (AVC) actuators by on-chip assembly using in-plane electrothermal actuators and latching mechanisms. The on-chip assembly process is carried out by engaging latching mechanism connected to the torsion bars through the off-centered thinned down silicon beams. When the latching mechanism is fully engaged, the assembled AVC actuator forms permanent initial tilt angle by the retraction force of electrothermal actuators. The AVC actuators and latching mechanisms are fabricated on a silicon-on-insulator (SOI) wafer using three photomasks and three times of deep etch steps. The maximum optical scan angle of 30.7° is achieved at 4.56 kHz under the sinusoidal driving voltage of 0-80 V applied to the AVC actuator. After the reliability test performed by operating the actuator for 1.6 × 108 cycles at its resonance, the measured optical scan angle variation and resonant frequency change were within 1.1% and 8 Hz, respectively, and the robustness of the latched mechanism was ensured.
Bibliographical noteFunding Information:
This work is financially supported by the Ministry of Knowledge Economy (MKE) and Korea Institute for Advancement in Technology (KIAT) through the Workforce Development Program in Strategic Technology, Nano R&D program through the Korea Science and Engineering Foundation funded by the Ministry of Education, Science and Technology ( 2009-0083227 ), a Grant-in-Aid for Strategy Technology Development Programs from the Korea Ministry of Knowledge Economy (No. 10030037 ) and Seoul R&BD Program ( GR070039 ).
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Metals and Alloys
- Electrical and Electronic Engineering