App-oriented thermal management of mobile devices

Jihoon Park, Seokjun Lee, Hojung Cha

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The thermal issue for mobile devices becomes critical as the devices' performance increases to handle complicated applications. Conventional thermal management limits the performance of the entire device, degrading the quality of both foreground and background applications. This is not desirable because the quality of the foreground application, i.e., the frames per second (FPS), is directly affected, whereas users are generally not aware of the performance of background applications. In this paper, we propose an app-oriented thermal management scheme that specifically restricts background applications to preserve the FPS of foreground applications. For efficient thermal management, we developed a model that predicts the heat contribution of individual applications based on hardware utilization. The proposed system gradually limits system resources for each background application according to its heat contribution. The scheme was implemented on a Galaxy S8+ smartphone, and its usefulness was validated with a thorough evaluation.

Original languageEnglish
Title of host publicationISLPED 2018 - Proceedings of the 2018 International Symposium on Low Power Electronics and Design
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781450357043
DOIs
Publication statusPublished - 2018 Jul 23
Event23rd IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2018 - Bellevue, United States
Duration: 2018 Jul 232018 Jul 25

Publication series

NameProceedings of the International Symposium on Low Power Electronics and Design
ISSN (Print)1533-4678

Other

Other23rd IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2018
CountryUnited States
CityBellevue
Period18/7/2318/7/25

Fingerprint

Application programs
Mobile devices
Temperature control
Galaxies
Thermal management (electronics)
Smartphones
Hardware
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Park, J., Lee, S., & Cha, H. (2018). App-oriented thermal management of mobile devices. In ISLPED 2018 - Proceedings of the 2018 International Symposium on Low Power Electronics and Design [a36] (Proceedings of the International Symposium on Low Power Electronics and Design). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1145/3218603.3218622
Park, Jihoon ; Lee, Seokjun ; Cha, Hojung. / App-oriented thermal management of mobile devices. ISLPED 2018 - Proceedings of the 2018 International Symposium on Low Power Electronics and Design. Institute of Electrical and Electronics Engineers Inc., 2018. (Proceedings of the International Symposium on Low Power Electronics and Design).
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Park, J, Lee, S & Cha, H 2018, App-oriented thermal management of mobile devices. in ISLPED 2018 - Proceedings of the 2018 International Symposium on Low Power Electronics and Design., a36, Proceedings of the International Symposium on Low Power Electronics and Design, Institute of Electrical and Electronics Engineers Inc., 23rd IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2018, Bellevue, United States, 18/7/23. https://doi.org/10.1145/3218603.3218622

App-oriented thermal management of mobile devices. / Park, Jihoon; Lee, Seokjun; Cha, Hojung.

ISLPED 2018 - Proceedings of the 2018 International Symposium on Low Power Electronics and Design. Institute of Electrical and Electronics Engineers Inc., 2018. a36 (Proceedings of the International Symposium on Low Power Electronics and Design).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Park J, Lee S, Cha H. App-oriented thermal management of mobile devices. In ISLPED 2018 - Proceedings of the 2018 International Symposium on Low Power Electronics and Design. Institute of Electrical and Electronics Engineers Inc. 2018. a36. (Proceedings of the International Symposium on Low Power Electronics and Design). https://doi.org/10.1145/3218603.3218622