A system-level electromagnetic (EM) modeling tool combining a three-dimensional (3-D) full-wave finite-element EMfield analysis tool and a time-domain electric-circuit simulator is developed and applied to various geometries such as multilayer printed circuit boards (PCB's), signal lines embedded in a PCB or package, and split power-distribution network. Since the signal integrity is a primary concern of high-speed digital circuits, the noise distributions on various circuit planes are evaluated from the analysis. These noise distributions, often called noice maps, are utilized to identify the location of the major source of simultaneous switching noise (SSN). This information can eventually be adapted for optimum placement of decoupling capacitors to minimize the noise fluctuations on the various circuit planes on an entire PCB.
|Number of pages||10|
|Journal||IEEE Transactions on Microwave Theory and Techniques|
|Issue number||10 PART 2|
|Publication status||Published - 1997|
Bibliographical noteFunding Information:
Manuscript received February 25, 1997; revised June 6, 1997. This work was supported under a grant from Intel Corporation. J.-G. Yook, L. P. B. Katehi, and K. A. Sakallah are with the Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI 48109-2122 USA. R. S. Martin, L. Huang, and T. A. Schreyer are with the Intel Corporation, Hillsboro, OR 97124-5961 USA. Publisher Item Identifier S 0018-9480(97)07387-0.
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Electrical and Electronic Engineering