Application of the flip-chip bonding technique to the 10 Gbps laser diode module

Goo Kim Dong, Han Haksoo, Seong Su Park, Joo Gwanchong, Min Kyu Song, Hwang Nam, Seung Goo Kang, Hee Tae Lee, Hyung Moo Park

Research output: Contribution to journalConference articlepeer-review

2 Citations (Scopus)

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Chemistry

Engineering & Materials Science