For high performance microelectronics and MEMS packaging, ceramic-based packages are preferred over plastics. There are a number of ways that ceramic-to-metal joining is of important concern in such applications. In this paper, the partial transient liquid phase bonding (PTLPB) method for ceramic-to-metal joining is reviewed. This method does not require high joining pressure and stringent surface preparation for cleanliness as in diffusion bonding. With a proper selection of filler metals, this method can produce more heat-resistant joints than those manufactured by brazing. In this study, Si3N4 has been successfully joined to Inconel 718 using PTLPB with thin multi-layers of Ti-Cu, Ti-Ni and Ti-Cu-Ni at temperatures lower than 1000 °C. The interfacial structure has been investigated using SEM and TEM. The processing conditions for high joint strength are also discussed.
|Title of host publication||2002 Proceedings - 8th International Advanced Packaging Materials Symposium|
|Publisher||Institute of Electrical and Electronics Engineers Inc.|
|Number of pages||9|
|ISBN (Electronic)||0780374347, 9780780374348|
|Publication status||Published - 2002|
|Event||8th International Advanced Packaging Materials Symposium - Stone Mountain, United States|
Duration: 2002 Mar 3 → 2002 Mar 6
|Name||2002 Proceedings - 8th International Advanced Packaging Materials Symposium|
|Other||8th International Advanced Packaging Materials Symposium|
|Period||02/3/3 → 02/3/6|
Bibliographical notePublisher Copyright:
© 2002 IEEE.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials