Application of the transient liquid phase bonding to microelectronics and MEMS packaging

Jin Woo Park; Thomas W. Eagar

doi:10.1109/ISAPM.2002.990362

Application of the transient liquid phase bonding to microelectronics and MEMS packaging

Jin Woo Park, Thomas W. Eagar

Department of Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

For high performance microelectronics and MEMS packaging, ceramic-based packages are preferred over plastics. There are a number of ways that ceramic-to-metal joining is of important concern in such applications. In this paper, the partial transient liquid phase bonding (PTLPB) method for ceramic-to-metal joining is reviewed. This method does not require high joining pressure and stringent surface preparation for cleanliness as in diffusion bonding. With a proper selection of filler metals, this method can produce more heat-resistant joints than those manufactured by brazing. In this study, Si₃N₄ has been successfully joined to Inconel 718 using PTLPB with thin multi-layers of Ti-Cu, Ti-Ni and Ti-Cu-Ni at temperatures lower than 1000 °C. The interfacial structure has been investigated using SEM and TEM. The processing conditions for high joint strength are also discussed.

Original language	English
Title of host publication	2002 Proceedings - 8th International Advanced Packaging Materials Symposium
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	30-38
Number of pages	9
ISBN (Electronic)	0780374347, 9780780374348
DOIs	https://doi.org/10.1109/ISAPM.2002.990362
Publication status	Published - 2002
Event	8th International Advanced Packaging Materials Symposium - Stone Mountain, United States Duration: 2002 Mar 3 → 2002 Mar 6

Publication series

Name	2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Other

Other	8th International Advanced Packaging Materials Symposium
Country/Territory	United States
City	Stone Mountain
Period	02/3/3 → 02/3/6

Bibliographical note

Publisher Copyright:
© 2002 IEEE.

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials

Access to Document

10.1109/ISAPM.2002.990362

Cite this

Park, J. W., & Eagar, T. W. (2002). Application of the transient liquid phase bonding to microelectronics and MEMS packaging. In 2002 Proceedings - 8th International Advanced Packaging Materials Symposium (pp. 30-38). [990362] (2002 Proceedings - 8th International Advanced Packaging Materials Symposium). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISAPM.2002.990362

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abstract = "For high performance microelectronics and MEMS packaging, ceramic-based packages are preferred over plastics. There are a number of ways that ceramic-to-metal joining is of important concern in such applications. In this paper, the partial transient liquid phase bonding (PTLPB) method for ceramic-to-metal joining is reviewed. This method does not require high joining pressure and stringent surface preparation for cleanliness as in diffusion bonding. With a proper selection of filler metals, this method can produce more heat-resistant joints than those manufactured by brazing. In this study, Si3N4 has been successfully joined to Inconel 718 using PTLPB with thin multi-layers of Ti-Cu, Ti-Ni and Ti-Cu-Ni at temperatures lower than 1000 °C. The interfacial structure has been investigated using SEM and TEM. The processing conditions for high joint strength are also discussed.",

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Park, JW & Eagar, TW 2002, Application of the transient liquid phase bonding to microelectronics and MEMS packaging. in 2002 Proceedings - 8th International Advanced Packaging Materials Symposium., 990362, 2002 Proceedings - 8th International Advanced Packaging Materials Symposium, Institute of Electrical and Electronics Engineers Inc., pp. 30-38, 8th International Advanced Packaging Materials Symposium, Stone Mountain, United States, 02/3/3. https://doi.org/10.1109/ISAPM.2002.990362

Application of the transient liquid phase bonding to microelectronics and MEMS packaging. / Park, Jin Woo; Eagar, Thomas W.

2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc., 2002. p. 30-38 990362 (2002 Proceedings - 8th International Advanced Packaging Materials Symposium).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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Park JW, Eagar TW. Application of the transient liquid phase bonding to microelectronics and MEMS packaging. In 2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc. 2002. p. 30-38. 990362. (2002 Proceedings - 8th International Advanced Packaging Materials Symposium). doi: 10.1109/ISAPM.2002.990362

Application of the transient liquid phase bonding to microelectronics and MEMS packaging

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