Application of the transient liquid phase bonding to microelectronics and MEMS packaging

Jin Woo Park, Thomas W. Eagar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

For high performance microelectronics and MEMS packaging, ceramic-based packages are preferred over plastics. There are a number of ways that ceramic-to-metal joining is of important concern in such applications. In this paper, the partial transient liquid phase bonding (PTLPB) method for ceramic-to-metal joining is reviewed. This method does not require high joining pressure and stringent surface preparation for cleanliness as in diffusion bonding. With a proper selection of filler metals, this method can produce more heat-resistant joints than those manufactured by brazing. In this study, Si3N4 has been successfully joined to Inconel 718 using PTLPB with thin multi-layers of Ti-Cu, Ti-Ni and Ti-Cu-Ni at temperatures lower than 1000 °C. The interfacial structure has been investigated using SEM and TEM. The processing conditions for high joint strength are also discussed.

Original languageEnglish
Title of host publication2002 Proceedings - 8th International Advanced Packaging Materials Symposium
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages30-38
Number of pages9
ISBN (Electronic)0780374347, 9780780374348
DOIs
Publication statusPublished - 2002 Jan 1
Event8th International Advanced Packaging Materials Symposium - Stone Mountain, United States
Duration: 2002 Mar 32002 Mar 6

Other

Other8th International Advanced Packaging Materials Symposium
CountryUnited States
CityStone Mountain
Period02/3/302/3/6

Fingerprint

Microelectronics
Joining
MEMS
Packaging
Liquids
Metals
Diffusion bonding
Filler metals
Brazing
Plastics
Transmission electron microscopy
Scanning electron microscopy
Processing
Temperature
titanium nickelide
Hot Temperature
silicon nitride

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials

Cite this

Park, J. W., & Eagar, T. W. (2002). Application of the transient liquid phase bonding to microelectronics and MEMS packaging. In 2002 Proceedings - 8th International Advanced Packaging Materials Symposium (pp. 30-38). [990362] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISAPM.2002.990362
Park, Jin Woo ; Eagar, Thomas W. / Application of the transient liquid phase bonding to microelectronics and MEMS packaging. 2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc., 2002. pp. 30-38
@inproceedings{3aea5bbf2f604036bd704571d53071f2,
title = "Application of the transient liquid phase bonding to microelectronics and MEMS packaging",
abstract = "For high performance microelectronics and MEMS packaging, ceramic-based packages are preferred over plastics. There are a number of ways that ceramic-to-metal joining is of important concern in such applications. In this paper, the partial transient liquid phase bonding (PTLPB) method for ceramic-to-metal joining is reviewed. This method does not require high joining pressure and stringent surface preparation for cleanliness as in diffusion bonding. With a proper selection of filler metals, this method can produce more heat-resistant joints than those manufactured by brazing. In this study, Si3N4 has been successfully joined to Inconel 718 using PTLPB with thin multi-layers of Ti-Cu, Ti-Ni and Ti-Cu-Ni at temperatures lower than 1000 °C. The interfacial structure has been investigated using SEM and TEM. The processing conditions for high joint strength are also discussed.",
author = "Park, {Jin Woo} and Eagar, {Thomas W.}",
year = "2002",
month = "1",
day = "1",
doi = "10.1109/ISAPM.2002.990362",
language = "English",
pages = "30--38",
booktitle = "2002 Proceedings - 8th International Advanced Packaging Materials Symposium",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",

}

Park, JW & Eagar, TW 2002, Application of the transient liquid phase bonding to microelectronics and MEMS packaging. in 2002 Proceedings - 8th International Advanced Packaging Materials Symposium., 990362, Institute of Electrical and Electronics Engineers Inc., pp. 30-38, 8th International Advanced Packaging Materials Symposium, Stone Mountain, United States, 02/3/3. https://doi.org/10.1109/ISAPM.2002.990362

Application of the transient liquid phase bonding to microelectronics and MEMS packaging. / Park, Jin Woo; Eagar, Thomas W.

2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc., 2002. p. 30-38 990362.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Application of the transient liquid phase bonding to microelectronics and MEMS packaging

AU - Park, Jin Woo

AU - Eagar, Thomas W.

PY - 2002/1/1

Y1 - 2002/1/1

N2 - For high performance microelectronics and MEMS packaging, ceramic-based packages are preferred over plastics. There are a number of ways that ceramic-to-metal joining is of important concern in such applications. In this paper, the partial transient liquid phase bonding (PTLPB) method for ceramic-to-metal joining is reviewed. This method does not require high joining pressure and stringent surface preparation for cleanliness as in diffusion bonding. With a proper selection of filler metals, this method can produce more heat-resistant joints than those manufactured by brazing. In this study, Si3N4 has been successfully joined to Inconel 718 using PTLPB with thin multi-layers of Ti-Cu, Ti-Ni and Ti-Cu-Ni at temperatures lower than 1000 °C. The interfacial structure has been investigated using SEM and TEM. The processing conditions for high joint strength are also discussed.

AB - For high performance microelectronics and MEMS packaging, ceramic-based packages are preferred over plastics. There are a number of ways that ceramic-to-metal joining is of important concern in such applications. In this paper, the partial transient liquid phase bonding (PTLPB) method for ceramic-to-metal joining is reviewed. This method does not require high joining pressure and stringent surface preparation for cleanliness as in diffusion bonding. With a proper selection of filler metals, this method can produce more heat-resistant joints than those manufactured by brazing. In this study, Si3N4 has been successfully joined to Inconel 718 using PTLPB with thin multi-layers of Ti-Cu, Ti-Ni and Ti-Cu-Ni at temperatures lower than 1000 °C. The interfacial structure has been investigated using SEM and TEM. The processing conditions for high joint strength are also discussed.

UR - http://www.scopus.com/inward/record.url?scp=84949934234&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84949934234&partnerID=8YFLogxK

U2 - 10.1109/ISAPM.2002.990362

DO - 10.1109/ISAPM.2002.990362

M3 - Conference contribution

SP - 30

EP - 38

BT - 2002 Proceedings - 8th International Advanced Packaging Materials Symposium

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Park JW, Eagar TW. Application of the transient liquid phase bonding to microelectronics and MEMS packaging. In 2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc. 2002. p. 30-38. 990362 https://doi.org/10.1109/ISAPM.2002.990362