Application of the transient liquid phase bonding to microelectronics and MEMS packaging

Jin Woo Park, Thomas W. Eagar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

For high performance microelectronics and MEMS packaging, ceramic-based packages are preferred over plastics. There are a number of ways that ceramic-to-metal joining is of important concern in such applications. In this paper, the partial transient liquid phase bonding (PTLPB) method for ceramic-to-metal joining is reviewed. This method does not require high joining pressure and stringent surface preparation for cleanliness as in diffusion bonding. With a proper selection of filler metals, this method can produce more heat-resistant joints than those manufactured by brazing. In this study, Si3N4 has been successfully joined to Inconel 718 using PTLPB with thin multi-layers of Ti-Cu, Ti-Ni and Ti-Cu-Ni at temperatures lower than 1000 °C. The interfacial structure has been investigated using SEM and TEM. The processing conditions for high joint strength are also discussed.

Original languageEnglish
Title of host publication2002 Proceedings - 8th International Advanced Packaging Materials Symposium
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages30-38
Number of pages9
ISBN (Electronic)0780374347, 9780780374348
DOIs
Publication statusPublished - 2002 Jan 1
Event8th International Advanced Packaging Materials Symposium - Stone Mountain, United States
Duration: 2002 Mar 32002 Mar 6

Publication series

Name2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Other

Other8th International Advanced Packaging Materials Symposium
CountryUnited States
CityStone Mountain
Period02/3/302/3/6

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials

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    Park, J. W., & Eagar, T. W. (2002). Application of the transient liquid phase bonding to microelectronics and MEMS packaging. In 2002 Proceedings - 8th International Advanced Packaging Materials Symposium (pp. 30-38). [990362] (2002 Proceedings - 8th International Advanced Packaging Materials Symposium). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISAPM.2002.990362