Recently, with scaling down of semiconductor devices, need for nanotechnology has increased enormously. For nanoscale devices especially, each of the layers should be as thin and as perfect as possible. Thus, the application of atomic layer deposition (ALD) to nanofabrication strategies and emerging nanodevices has sparked a good deal of interest due to its inherent benefits compared to other thin film deposition techniques. Since the ALD process is intrinsically atomic in nature and results in the controlled deposition of films at the atomic scale, ALD produces layers with nanometer scale thickness control and excellent conformality. In this report, we review current research trends in ALD processes, focusing on the application of ALD to emerging nanodevices utilizing fabrication through nanotechnology.
Bibliographical noteFunding Information:
This work was supported by the Korea Research Foundation (MOEHRD, KRF-2005-005-J13102 and KRF-2007-331-D00243), POSTECH Core Research Program, Korea Ministry of Commerce, Industry, and Energy (System IC 2010, Commercialization Program of Nano Process Equipments, and Infra technology development for Electronic parts), and the Korea Science and Engineering Foundation (KOSEF) grant (No. R01-2007-000-20143-0 and 2007-02864). Mr. Maeng and Mr. Lee were financially supported by the second stage of the Brain Korea 21 project and we thank Professor M.-H. Jo at POSTECH for providing us with Ge NWs.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Metals and Alloys
- Materials Chemistry