Atomic layer deposition of SnO2 thin films using tetraethyltin and H2O2

Sang Soon Lim, In Hwan Baek, Kwang Chon Kim, Seung Hyub Baek, Hyung Ho Park, Jin Sang Kim, Seong Keun Kim

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The atomic layer deposition (ALD) of SnO2 films has drawn interest from many researchers as a way to enhance the performance of functional materials for emerging applications such as transistors, sensors, and transparent electrodes. Among the critical issues in the exploitation of SnO2 ALD in industrial applications is the lack of commercially available Sn precursors. Here, we demonstrate an ALD process for SnO2 films using commercially available tetraethyltin (TET) as a precursor. H2O2 is used as the oxygen source to overcome the lack of reactivity between TET and H2O, consequently the reaction of TET and H2O2 results in the growth of SnO2 films. The ALD process has a wide ALD window of 250–400 °C. In the range of the growth temperature, the grown films show a high density of ~6.2 g/cm3 and an optical band gap of 3.7–3.9 eV, which is comparable to that of bulk SnO2. Negligible impurities remained in the films grown over the entire temperature range. The crystallization behavior and electrical properties of the SnO2 films were examined as well. The ability of this ALD process to produce high-quality SnO2 films with a commercially available tin precursor will allow it to be exploited in various applications.

Original languageEnglish
Pages (from-to)20600-20605
Number of pages6
JournalCeramics International
Issue number16
Publication statusPublished - 2019 Nov

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Process Chemistry and Technology
  • Surfaces, Coatings and Films
  • Materials Chemistry

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    Lim, S. S., Baek, I. H., Kim, K. C., Baek, S. H., Park, H. H., Kim, J. S., & Kim, S. K. (2019). Atomic layer deposition of SnO2 thin films using tetraethyltin and H2O2 Ceramics International, 45(16), 20600-20605.