We develop the atomic layer deposition (ALD) process of titanium silicate with halide-free precursor and evaluate film properties as a spacer for self-aligned double/quadruple patterning (SADP/SAQP). Growth characteristics are investigated depending on substrate temperature. Growth per cycle (GPC) at 100 °C is largely observed than the estimated value, while that as 200 °C shows an opposite trend. There have been reports on ALD ternary oxides, but different growth characteristics observed in this work have not been fully understood. In this work, the growth behavior of ALD titanium silicate are studied by correlating different characterization results, including infrared spectra, chemical compositions, and X-ray reflection spectra. Correlative results suggest that the surface density of hydroxyl group would be a key role for different growth characteristics of titanium silicates. Also, the feasibility of ALD titanium silicate as a spacer is evaluated, such as etch rates and deposited titanium silicates shows better quality than a conventional SiO2 spacer. This study on ALD titanium silicate should significantly expand multi-patterning applications, especially in a semiconductor field.
|Title of host publication||2021 IEEE International Interconnect Technology Conference, IITC 2021|
|Publisher||Institute of Electrical and Electronics Engineers Inc.|
|Publication status||Published - 2021 Jul 6|
|Event||24th Annual IEEE International Interconnect Technology Conference, IITC 2021 - Virtual, Kyoto, Japan|
Duration: 2021 Jul 6 → 2021 Jul 9
|Name||2021 IEEE International Interconnect Technology Conference, IITC 2021|
|Conference||24th Annual IEEE International Interconnect Technology Conference, IITC 2021|
|Period||21/7/6 → 21/7/9|
Bibliographical notePublisher Copyright:
© 2021 IEEE.
All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Surfaces, Coatings and Films