Atomic Layer Deposition of Titanium Silicate for Multi-Patterning Process

Sanghun Lee, Seunggi Seo, Wontae Noh, Il Kwon Oh, Hyungjun Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We develop the atomic layer deposition (ALD) process of titanium silicate with halide-free precursor and evaluate film properties as a spacer for self-aligned double/quadruple patterning (SADP/SAQP). Growth characteristics are investigated depending on substrate temperature. Growth per cycle (GPC) at 100 °C is largely observed than the estimated value, while that as 200 °C shows an opposite trend. There have been reports on ALD ternary oxides, but different growth characteristics observed in this work have not been fully understood. In this work, the growth behavior of ALD titanium silicate are studied by correlating different characterization results, including infrared spectra, chemical compositions, and X-ray reflection spectra. Correlative results suggest that the surface density of hydroxyl group would be a key role for different growth characteristics of titanium silicates. Also, the feasibility of ALD titanium silicate as a spacer is evaluated, such as etch rates and deposited titanium silicates shows better quality than a conventional SiO2 spacer. This study on ALD titanium silicate should significantly expand multi-patterning applications, especially in a semiconductor field.

Original languageEnglish
Title of host publication2021 IEEE International Interconnect Technology Conference, IITC 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728176321
DOIs
Publication statusPublished - 2021 Jul 6
Event24th Annual IEEE International Interconnect Technology Conference, IITC 2021 - Virtual, Kyoto, Japan
Duration: 2021 Jul 62021 Jul 9

Publication series

Name2021 IEEE International Interconnect Technology Conference, IITC 2021

Conference

Conference24th Annual IEEE International Interconnect Technology Conference, IITC 2021
Country/TerritoryJapan
CityVirtual, Kyoto
Period21/7/621/7/9

Bibliographical note

Publisher Copyright:
© 2021 IEEE.

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

Fingerprint

Dive into the research topics of 'Atomic Layer Deposition of Titanium Silicate for Multi-Patterning Process'. Together they form a unique fingerprint.

Cite this