Atomic layer deposition ZnO:N thin film transistor: The effects of N concentration on the device properties

S. J. Lim, Jae Min Kim, Doyoung Kim, Soonju Kwon, Jin Seong Park, Hyungjun Kim

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Abstract

The electrical properties of atomic layer deposition (ALD) nitrogen-doped ZnO (ZnO:N) thin films were investigated as a function of incorporated nitrogen concentration. The nitrogen concentrations in the films were controlled by using different concentrations of NH4 OH solution, which was used as a single source for the reactant and nitrogen doping for ALD ZnO:N. The carrier concentrations in ALD ZnO:N decreased down to 6.13× 1013 / cm3 using 29% NH4 OH solution. Thin film transistors (TFTs) were fabricated using ALD ZnO:N thin films with different N contents as active channel layers. The device properties were significantly changed by the amount of nitrogen incorporation due to the change in the electrical properties of ZnO:N films. Especially, threshold voltages were changed from 20.0 to 3.1 V by adjusting nitrogen doping. Additionally, dc bias stability was enhanced by the increment in nitrogen concentration, producing a robust TFT at high nitrogen incorporation. Finally, a high performance flexible TFT was fabricated using ALD ZnO:N as an active layer on poly(ethylene naphthalate) substrate.

Original languageEnglish
Pages (from-to)H214-H218
JournalJournal of the Electrochemical Society
Volume157
Issue number2
DOIs
Publication statusPublished - 2010 Jan 15

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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