Wafer-scale beamforming lenses for future IEEE802.15.3c 60 GHz WPAN applications are presented. An on-wafer fabrication is of particular interest because a beamforming lens can be fabricated with sub-circuits in a single process. It means that the beamforming lens system would be compact, reliable, and cost-effective. The Rotman lens and the Rotman lens with antenna arrays were fabricated on a high-resistivity silicon (HRS) wafer in a semiconductor process, which is a preliminary research to check the feasibility of a Rotman lens for a chip scale packaging. In the case of the Rotman lens only, the efficiency is in the range from 50% to 70% depending on which beam port is excited. Assuming that the lens is coupled with ideal isotropic antennas, the synthesized beam patterns from the S-parameters shows that the beam directions are -29.3°, -15.1°, 0.2°, 15.2°, and 29.5°, and the beam widths are 15.37°, 15.62°, 15.46°, 15.51°, and 15.63°, respectively. In the case of the Rotman lens with antenna array, the patterns were measured by using on-wafer measurement setup. It shows that the beam directions are -26.6°, -21.8°, 0°, 21.8°, and 26.6°. These results are in good agreement with the calculated results from ray-optic. Thus, it is verified that the lens antenna implemented on a wafer can be feasible for the system-in-package (SiP) and wafer-level package technologies.
Bibliographical noteFunding Information:
Manuscript received May 15, 2009; revised August 24, 2009. First published December 31, 2009; current version published March 03, 2010. This work was supported by the Korea Science and Engineering Foundation (KOSEF) funded by the Korean Government under Grant (R01-2007-000-11294-0).
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering