Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon

Jong Hyun Ahn, Hoon Sik Kim, Etienne Menard, Keon Jae Lee, Zhengtao Zhu, Dae Hyeong Kim, Ralph G. Nuzzo, John A. Rogers, Islamshah Amlani, Vadim Kushner, Shawn G. Thomas, Terrisa Duenas

Research output: Contribution to journalArticlepeer-review

75 Citations (Scopus)


This letter presents studies of several simple integrated circuits- n -channel metal-oxide semiconductor inverters, five-stage ring oscillators, and differential amplifiers-formed on thin, bendable plastic substrates with printed ribbons of ultrathin single-crystalline silicon as the semiconductor. The inverters exhibit gains as high as 2.5, the ring oscillators operate with oscillation frequencies between 8 and 9 MHz at low supply voltages (∼4 V), and the differential amplifiers show good performance and voltage gains of 1.3 for 500 mV input signals. The responses of these systems to bending-induced strains show that relatively moderate changes of individual transistors can be significant for the operation of circuits that incorporate many transistors.

Original languageEnglish
Article number213501
JournalApplied Physics Letters
Issue number21
Publication statusPublished - 2007

Bibliographical note

Funding Information:
This work was supported by the Department of Energy (DEFG02-91ER45439) and used the Center for Microanalysis of Materials of the Frederick Seitz Materials Research Laboratory supported by the Department of Energy (DEFG02-91ER45439). Work in developing the differential amplifiers was partially supported by NextGen Aeronautics under Department of Defense Small Business Research Innovation Program (W31P4Q-05–C0308).

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)


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