Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon

Jong Hyun Ahn, Hoon Sik Kim, Etienne Menard, Keon Jae Lee, Zhengtao Zhu, Dae Hyeong Kim, Ralph G. Nuzzo, John A. Rogers, Islamshah Amlani, Vadim Kushner, Shawn G. Thomas, Terrisa Duenas

Research output: Contribution to journalArticle

68 Citations (Scopus)

Abstract

This letter presents studies of several simple integrated circuits- n -channel metal-oxide semiconductor inverters, five-stage ring oscillators, and differential amplifiers-formed on thin, bendable plastic substrates with printed ribbons of ultrathin single-crystalline silicon as the semiconductor. The inverters exhibit gains as high as 2.5, the ring oscillators operate with oscillation frequencies between 8 and 9 MHz at low supply voltages (∼4 V), and the differential amplifiers show good performance and voltage gains of 1.3 for 500 mV input signals. The responses of these systems to bending-induced strains show that relatively moderate changes of individual transistors can be significant for the operation of circuits that incorporate many transistors.

Original languageEnglish
Article number213501
JournalApplied Physics Letters
Volume90
Issue number21
DOIs
Publication statusPublished - 2007 Jun 1

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differential amplifiers
inverters
ribbons
integrated circuits
transistors
plastics
oscillators
rings
electric potential
silicon
metal oxide semiconductors
oscillations

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

Cite this

Ahn, Jong Hyun ; Kim, Hoon Sik ; Menard, Etienne ; Lee, Keon Jae ; Zhu, Zhengtao ; Kim, Dae Hyeong ; Nuzzo, Ralph G. ; Rogers, John A. ; Amlani, Islamshah ; Kushner, Vadim ; Thomas, Shawn G. ; Duenas, Terrisa. / Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon. In: Applied Physics Letters. 2007 ; Vol. 90, No. 21.
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Ahn, JH, Kim, HS, Menard, E, Lee, KJ, Zhu, Z, Kim, DH, Nuzzo, RG, Rogers, JA, Amlani, I, Kushner, V, Thomas, SG & Duenas, T 2007, 'Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon', Applied Physics Letters, vol. 90, no. 21, 213501. https://doi.org/10.1063/1.2742294

Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon. / Ahn, Jong Hyun; Kim, Hoon Sik; Menard, Etienne; Lee, Keon Jae; Zhu, Zhengtao; Kim, Dae Hyeong; Nuzzo, Ralph G.; Rogers, John A.; Amlani, Islamshah; Kushner, Vadim; Thomas, Shawn G.; Duenas, Terrisa.

In: Applied Physics Letters, Vol. 90, No. 21, 213501, 01.06.2007.

Research output: Contribution to journalArticle

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