Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon

Jong Hyun Ahn; Hoon Sik Kim; Etienne Menard; Keon Jae Lee; Zhengtao Zhu; Dae Hyeong Kim; Ralph G. Nuzzo; John A. Rogers; Islamshah Amlani; Vadim Kushner; Shawn G. Thomas; Terrisa Duenas

doi:10.1063/1.2742294

Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon

Jong Hyun Ahn, Hoon Sik Kim, Etienne Menard, Keon Jae Lee, Zhengtao Zhu, Dae Hyeong Kim, Ralph G. Nuzzo, John A. Rogers, Islamshah Amlani, Vadim Kushner, Shawn G. Thomas, Terrisa Duenas

Department of Electrical and Electronic Engineering

Research output: Contribution to journal › Article › peer-review

75 Citations (Scopus)

Abstract

This letter presents studies of several simple integrated circuits- n -channel metal-oxide semiconductor inverters, five-stage ring oscillators, and differential amplifiers-formed on thin, bendable plastic substrates with printed ribbons of ultrathin single-crystalline silicon as the semiconductor. The inverters exhibit gains as high as 2.5, the ring oscillators operate with oscillation frequencies between 8 and 9 MHz at low supply voltages (∼4 V), and the differential amplifiers show good performance and voltage gains of 1.3 for 500 mV input signals. The responses of these systems to bending-induced strains show that relatively moderate changes of individual transistors can be significant for the operation of circuits that incorporate many transistors.

Original language	English
Article number	213501
Journal	Applied Physics Letters
Volume	90
Issue number	21
DOIs	https://doi.org/10.1063/1.2742294
Publication status	Published - 2007

Bibliographical note

Funding Information:
This work was supported by the Department of Energy (DEFG02-91ER45439) and used the Center for Microanalysis of Materials of the Frederick Seitz Materials Research Laboratory supported by the Department of Energy (DEFG02-91ER45439). Work in developing the differential amplifiers was partially supported by NextGen Aeronautics under Department of Defense Small Business Research Innovation Program (W31P4Q-05–C0308).

All Science Journal Classification (ASJC) codes

Physics and Astronomy (miscellaneous)

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10.1063/1.2742294

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title = "Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon",

abstract = "This letter presents studies of several simple integrated circuits- n -channel metal-oxide semiconductor inverters, five-stage ring oscillators, and differential amplifiers-formed on thin, bendable plastic substrates with printed ribbons of ultrathin single-crystalline silicon as the semiconductor. The inverters exhibit gains as high as 2.5, the ring oscillators operate with oscillation frequencies between 8 and 9 MHz at low supply voltages (∼4 V), and the differential amplifiers show good performance and voltage gains of 1.3 for 500 mV input signals. The responses of these systems to bending-induced strains show that relatively moderate changes of individual transistors can be significant for the operation of circuits that incorporate many transistors.",

author = "Ahn, {Jong Hyun} and Kim, {Hoon Sik} and Etienne Menard and Lee, {Keon Jae} and Zhengtao Zhu and Kim, {Dae Hyeong} and Nuzzo, {Ralph G.} and Rogers, {John A.} and Islamshah Amlani and Vadim Kushner and Thomas, {Shawn G.} and Terrisa Duenas",

note = "Funding Information: This work was supported by the Department of Energy (DEFG02-91ER45439) and used the Center for Microanalysis of Materials of the Frederick Seitz Materials Research Laboratory supported by the Department of Energy (DEFG02-91ER45439). Work in developing the differential amplifiers was partially supported by NextGen Aeronautics under Department of Defense Small Business Research Innovation Program (W31P4Q-05–C0308).",

year = "2007",

doi = "10.1063/1.2742294",

language = "English",

volume = "90",

journal = "Applied Physics Letters",

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AU - Ahn, Jong Hyun

AU - Kim, Hoon Sik

AU - Menard, Etienne

AU - Lee, Keon Jae

AU - Zhu, Zhengtao

AU - Kim, Dae Hyeong

AU - Nuzzo, Ralph G.

AU - Rogers, John A.

AU - Amlani, Islamshah

AU - Kushner, Vadim

AU - Thomas, Shawn G.

AU - Duenas, Terrisa

N1 - Funding Information: This work was supported by the Department of Energy (DEFG02-91ER45439) and used the Center for Microanalysis of Materials of the Frederick Seitz Materials Research Laboratory supported by the Department of Energy (DEFG02-91ER45439). Work in developing the differential amplifiers was partially supported by NextGen Aeronautics under Department of Defense Small Business Research Innovation Program (W31P4Q-05–C0308).

PY - 2007

Y1 - 2007

N2 - This letter presents studies of several simple integrated circuits- n -channel metal-oxide semiconductor inverters, five-stage ring oscillators, and differential amplifiers-formed on thin, bendable plastic substrates with printed ribbons of ultrathin single-crystalline silicon as the semiconductor. The inverters exhibit gains as high as 2.5, the ring oscillators operate with oscillation frequencies between 8 and 9 MHz at low supply voltages (∼4 V), and the differential amplifiers show good performance and voltage gains of 1.3 for 500 mV input signals. The responses of these systems to bending-induced strains show that relatively moderate changes of individual transistors can be significant for the operation of circuits that incorporate many transistors.

AB - This letter presents studies of several simple integrated circuits- n -channel metal-oxide semiconductor inverters, five-stage ring oscillators, and differential amplifiers-formed on thin, bendable plastic substrates with printed ribbons of ultrathin single-crystalline silicon as the semiconductor. The inverters exhibit gains as high as 2.5, the ring oscillators operate with oscillation frequencies between 8 and 9 MHz at low supply voltages (∼4 V), and the differential amplifiers show good performance and voltage gains of 1.3 for 500 mV input signals. The responses of these systems to bending-induced strains show that relatively moderate changes of individual transistors can be significant for the operation of circuits that incorporate many transistors.

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Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon

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Bibliographical note

All Science Journal Classification (ASJC) codes

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