Bidirectional electrothermal electromagnetic torsional microactuators

Eun Youngkee, Na Hyungjoo, Jongbaeg Kim

Research output: Contribution to journalConference article

3 Citations (Scopus)

Abstract

This paper presents a novel design of bidirectional torsional micromirror utilizing vertically driven electrothermal electromagnetic silicon beam actuators to generate large static angular motion. The microactuators are fabricated on silicon-on-insulator (SOI) wafer using three photo masks in order to form two different thicknesses of single crystal silicon (SCS) device layer and backside cavities. When the driving bias is applied to the device, four buckle beams placed alongside of the torsion bars are subjected to thermal expansion and buckle in vertical direction generating torsional displacement of the micromirror with respect to two torsion bars placed at the center. The direction of buckle is controlled by Lorentz force caused by the magnetic field applied and the amount of current flowing through the micro beam to be buckled, enabling the bidirectional motion of the torsional micromirror. The maximum static angular displacement of the torsional actuator is up to 14.35& deg; (28.7& deg;, optical angle) under driving DC voltage of 7.5V. For resonance mode operation, the measured angular displacement is 8.46& deg; (16.92& deg;, optical angle) at 10.94 kHz under sinusoidal driving voltage of 0 to 3V.

Original languageEnglish
Article number4805564
Pages (from-to)1039-1042
Number of pages4
JournalProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
DOIs
Publication statusPublished - 2009 Jun 1
Event22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009 - Sorrento, Italy
Duration: 2009 Jan 252009 Jan 29

Fingerprint

Microactuators
Silicon
electromagnetism
Torsional stress
torsion
silicon
Actuators
actuators
Lorentz force
Electric potential
electric potential
angular velocity
Thermal expansion
Masks
thermal expansion
masks
direct current
insulators
Single crystals
wafers

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

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title = "Bidirectional electrothermal electromagnetic torsional microactuators",
abstract = "This paper presents a novel design of bidirectional torsional micromirror utilizing vertically driven electrothermal electromagnetic silicon beam actuators to generate large static angular motion. The microactuators are fabricated on silicon-on-insulator (SOI) wafer using three photo masks in order to form two different thicknesses of single crystal silicon (SCS) device layer and backside cavities. When the driving bias is applied to the device, four buckle beams placed alongside of the torsion bars are subjected to thermal expansion and buckle in vertical direction generating torsional displacement of the micromirror with respect to two torsion bars placed at the center. The direction of buckle is controlled by Lorentz force caused by the magnetic field applied and the amount of current flowing through the micro beam to be buckled, enabling the bidirectional motion of the torsional micromirror. The maximum static angular displacement of the torsional actuator is up to 14.35& deg; (28.7& deg;, optical angle) under driving DC voltage of 7.5V. For resonance mode operation, the measured angular displacement is 8.46& deg; (16.92& deg;, optical angle) at 10.94 kHz under sinusoidal driving voltage of 0 to 3V.",
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Bidirectional electrothermal electromagnetic torsional microactuators. / Youngkee, Eun; Hyungjoo, Na; Kim, Jongbaeg.

In: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 01.06.2009, p. 1039-1042.

Research output: Contribution to journalConference article

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N2 - This paper presents a novel design of bidirectional torsional micromirror utilizing vertically driven electrothermal electromagnetic silicon beam actuators to generate large static angular motion. The microactuators are fabricated on silicon-on-insulator (SOI) wafer using three photo masks in order to form two different thicknesses of single crystal silicon (SCS) device layer and backside cavities. When the driving bias is applied to the device, four buckle beams placed alongside of the torsion bars are subjected to thermal expansion and buckle in vertical direction generating torsional displacement of the micromirror with respect to two torsion bars placed at the center. The direction of buckle is controlled by Lorentz force caused by the magnetic field applied and the amount of current flowing through the micro beam to be buckled, enabling the bidirectional motion of the torsional micromirror. The maximum static angular displacement of the torsional actuator is up to 14.35& deg; (28.7& deg;, optical angle) under driving DC voltage of 7.5V. For resonance mode operation, the measured angular displacement is 8.46& deg; (16.92& deg;, optical angle) at 10.94 kHz under sinusoidal driving voltage of 0 to 3V.

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