Biodegradable Polyanhydrides as Encapsulation Layers for Transient Electronics

Yeon Sik Choi, Jahyun Koo, Young Joong Lee, Geumbee Lee, Raudel Avila, Hanze Ying, Jonathan Reeder, Leonhard Hambitzer, Kyungtaek Im, Jungwon Kim, Kyung Mi Lee, Jianjun Cheng, Yonggang Huang, Seung Kyun Kang, John A. Rogers

Research output: Contribution to journalArticlepeer-review

38 Citations (Scopus)

Abstract

Bioresorbable electronic systems represent an emerging class of technology of interest due to their ability to dissolve, chemically degrade, disintegrate, and/or otherwise physically disappear harmlessly in biological environments, as the basis for temporary implants that avoid the need for secondary surgical extraction procedures. Polyanhydride-based polymers can serve as hydrophobic encapsulation layers for such systems, as a subset of the broader field of transient electronics, where biodegradation eventually occurs by chain scission. Systematic experimental studies that involve immersion in phosphate-buffered saline solution at various pH values and/or temperatures demonstrate that dissolution occurs through a surface erosion mechanism, with little swelling. The mechanical properties of this polymer are well suited for use in soft, flexible devices, where integration can occur through a mold-based photopolymerization technique. Studies of the dependence of the polymer properties on monomer compositions and the rates of permeation on coating thicknesses reveal some of the underlying effects. Simple demonstrations illustrate the ability to sustain operation of underlying biodegradable electronic systems for durations between a few hours to a week during complete immersion in aqueous solutions that approximate physiological conditions. Systematic chemical, physical, and in vivo biological studies in animal models reveal no signs of toxicity or other adverse biological responses.

Original languageEnglish
Article number2000941
JournalAdvanced Functional Materials
Volume30
Issue number31
DOIs
Publication statusPublished - 2020 Aug 1

Bibliographical note

Funding Information:
Y.S.C. and J.K. contributed equally to this work. This work made use of the NUFAB facility of Northwestern University's NUANCE Center, which has received support from the Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource (NSF ECCS-1542205); the MRSEC program (NSF DMR-1720139) at the Materials Research Center; the Querrey-Simpson Institute for Bioelectronics; the Keck Foundation; and the State of Illinois, through the IIN. J.K. acknowledges the support from Korea University (Grant No. K2008831) R.A. acknowledges support from the National Science Foundation Graduate Research Fellowship (NSF Grant No. 1842165) and Ford Foundation Predoctoral Fellowship. S.K.K. was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (NRF-2019R1C1C1004232) and by KIST Institutional Program (Project No. 2V07080-19-P141). J.Kim, K.L, and K.Lee were supported by NRF-2018M3A9D3079285.

Funding Information:
Y.S.C. and J.K. contributed equally to this work. This work made use of the NUFAB facility of Northwestern University's NUANCE Center, which has received support from the Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource (NSF ECCS‐1542205); the MRSEC program (NSF DMR‐1720139) at the Materials Research Center; the Querrey‐Simpson Institute for Bioelectronics; the Keck Foundation; and the State of Illinois, through the IIN. J.K. acknowledges the support from Korea University (Grant No. K2008831) R.A. acknowledges support from the National Science Foundation Graduate Research Fellowship (NSF Grant No. 1842165) and Ford Foundation Predoctoral Fellowship. S.K.K. was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (NRF‐2019R1C1C1004232) and by KIST Institutional Program (Project No. 2V07080‐19‐P141). J.Kim, K.L, and K.Lee were supported by NRF‐2018M3A9D3079285.

Publisher Copyright:
© 2020 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Materials Science(all)
  • Condensed Matter Physics

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