Block-based connected component labeling algorithm with block prediction

Yunseok Jang, Junwon Mun, Kyoungmook Oh, Jaeseok Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In this paper, we propose a block-based connected component labeling algorithm, which predicts current block’s label by exploiting the information obtained from previous block to reduce memory access. By generating a forest of decision trees according to some of previous block’s pixels, which are also needed for current block’s label decision, we can reduce trees’ depth and number of pixels to check. Experimental results show that our method is faster than the most recent labeling algorithms with image datasets which have various size and pixel density.

Original languageEnglish
Title of host publication2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017
EditorsNorbert Herencsar
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages578-581
Number of pages4
ISBN (Electronic)9781509039821
DOIs
Publication statusPublished - 2017 Oct 19
Event40th International Conference on Telecommunications and Signal Processing, TSP 2017 - Barcelona, Spain
Duration: 2017 Jul 52017 Jul 7

Publication series

Name2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017
Volume2017-January

Conference

Conference40th International Conference on Telecommunications and Signal Processing, TSP 2017
CountrySpain
CityBarcelona
Period17/7/517/7/7

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Signal Processing

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    Jang, Y., Mun, J., Oh, K., & Kim, J. (2017). Block-based connected component labeling algorithm with block prediction. In N. Herencsar (Ed.), 2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017 (pp. 578-581). (2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017; Vol. 2017-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TSP.2017.8076053