We developed a solution-processed indium oxide (In2O 3) thin-film transistor (TFT) with a boron-doped peroxo-zirconium (ZrO2:B) dielectric on silicon as well as polyimide substrate at 200 C, using water as the solvent for the In2O3 precursor. The formation of In2O3 and ZrO2:B films were intensively studied by thermogravimetric differential thermal analysis (TG-DTA), attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FT IR), high-resolution X-ray diffraction (HR-XRD), and X-ray photoelectron spectroscopy (XPS). Boron was selected as a dopant to make a denser ZrO 2 film. The ZrO2:B film effectively blocked the leakage current at 200 C with high breakdown strength. To evaluate the ZrO2:B film as a gate dielectric, we fabricated In2O3 TFTs on the ZrO2:B dielectrics with silicon substrates and annealed the resulting samples at 200 and 250 C. The resulting mobilities were 1.25 and 39.3 cm2/(V s), respectively. Finally, we realized a flexible In 2O3 TFT with the ZrO2:B dielectric on a polyimide substrate at 200 C, and it successfully operated a switching device with a mobility of 4.01 cm2/(V s). Our results suggest that aqueous solution-processed In2O3 TFTs on ZrO2:B dielectrics could potentially be used for low-cost, low-temperature, and high-performance flexible devices.
All Science Journal Classification (ASJC) codes
- Materials Science(all)